In addition to integrated circuit packaging technology for SMDs, chips, sensors, and optoelectronic components, we also offer leading-edge technologies for packaging miniaturized systems.
Microchips can be mounted and connected directly from the wafer onto printed circuit boards by using the die-attach and flip-chip technique. Handling imposes rigorous requirements on precision and cleanliness.read more
Surface mount technology (SMT) of electronic, optical and microsystem components (SMD) is one of the most important technologies for building miniaturized systems. On flat substrates, such as PCBs or on three-dimensional circuit carriers, such as molded interconnect devices (3D MIDs), SMT is the technological basis of electronic assemblies.read more
Hot sealing interconnects plastics solidly and permanently without the use of solvents. Components remain dimensionally stable: With hot stamping presses, the pressing force and pressing duration, temperature, and air pressure when joining plastics can be matched for an optimal result.read more
Reactive joining with nanometer multilayers – an innovative method for low-stress and gentle component assembly in microsystem technologyread more
At Hahn-Schickard different process variants of laser-based plastic welding are used: contour welding, quasi-simultaneous welding, simultaneous welding, and mask welding.read more
Wire bonding is the most important standard technique for electrical contacting offered by integrated circuit packaging technology. With wire bonding, highly-integrated assemblies, such as COB or MCM assemblies, are possible.read more
Flexible three-dimensional placement makes it possible to drive the advance of miniaturization and integrate function elements, such as SMD components, into a system with ever greater precision.read more