Integrated circuit packaging technology - Hahn-Schickard

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Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.

Chip placement

Microchips can be mounted and connected directly from the wafer onto printed circuit boards by using the die-attach and flip-chip technique. Handling imposes rigorous requirements on precision and cleanliness.

SMD assembly

Surface mount technology (SMT) of electronic, optical and microsystem components (SMD) is one of the most important technologies for building miniaturized systems. On flat substrates, such as PCBs or on three-dimensional circuit carriers, such as molded interconnect devices (3D MIDs), SMT is the technological basis of electronic assemblies.

Maximilian Barth

+49 711 685 83828 Contact

Competences

Microassembly
3D assembly
Wire bonding
Die attach
SMD assembly

Thermal sealing

Thermal sealing interconnects polymers solidly and permanently without the use of solvents. Components remain dimensionally stable: With hot presses, the pressing force and pressing duration, temperature, and air pressure when joining polymers can be matched for an optimal result.

Reactive joining processes

Reactive joining with nanometer multilayers – an innovative method for low-stress and gentle component assembly in microsystem technology

Dr.

Stephan Knappmann

+49 7721 943 224 Contact

Competences

Microassembly
Joining technology
Thin layers
Optics

Laser-based plastic welding

At Hahn-Schickard different process variants of laser-based plastic welding are used: contour welding, quasi-simultaneous welding, simultaneous welding, and mask welding.

Wire bonding

Wire bonding is the most important standard technique for electrical contacting offered by integrated circuit packaging technology. With wire bonding, highly-integrated assemblies, such as COB or MCM assemblies, are possible.

3D placement

Flexible three-dimensional placement makes it possible to drive the advance of miniaturization and integrate function elements, such as SMD components, into a system with ever greater precision.

Transfer molding

Film-assisted molding technology offers virtually pressureless encapsulation of sensitive microelectronic components with molding compounds that contain epoxy.