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Integrated circuit packaging technology

Solutions for microassembly and packaging of miniaturized components, process development, and transfer

In addition to integrated circuit packaging technology for SMDs, chips, sensors, and optoelectronic components, we also offer leading-edge technologies for packaging miniaturized systems.


  •    Microassembly
  •    3D assembly
  •    Wire bonding
  •    Die attach
  •    SMD assembly


Stephan Knappmann

+49 7721 943 224 Contact


  • Microassembly
  • Joining technology
  • Thin layers
  • Optics