Reactive joining with nanometer multilayers
An innovative method for low-stress and gentle assembly in microsystem technology. We develop reactive joining processes for substance-to-substance bonding of microsystem components.
With nanometer multilayers, we can achieve extremely local heating with very short process times, as compared to what can be accomplished with conventional joining methods. This enables low-stress, efficient heat-conducting, high strength, and hermetic connections.
With reactive joining, components made of different materials (metals, ceramic, glass, silicon) can be joined at room temperature at low-stress, firmly, and permanently. Partners produce the necessary custom-made reactive multilayers; we structure the layers and execute the reactive joining processes on our equipment. If necessary, the process parameters are adapted and optimized to achieve the best possible result. Then, if desired, the joint connections are examined with respect to strength, hermeticity and long-term stability. In addition, microscopic joint analyses are also possible.
Competence through many years of experience
Hahn-Schickard has many years of experience in the area of reactive joining. A die bonder, as well as a modified wafer bonder are available as process devices in the clean room, which enables to join even under vacuum or under a special gas atmosphere. If required, the surfaces of the parts to be joined will be pre-treated, i.e. they will be cleaned and provided with special additional coatings. As a special feature, at Hahn-Schickard the reactive layers can be precisely structured through a special laser process, which opens up new design possibilities. Thus, if necessary, preforms can be produced that are cut to the size of the surfaces to be joined.
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