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Microstructuring of surfaces

Processes for the microstructuring and functionalizing of components

We generate systems, sensor structures, and other functional structures on components made of different base materials. Our service offering includes various processes that are used in 3D circuit carriers, ultra-thin film-based microsystems and microtechnical components, to cite just a few applications.

Laser structuring

Through laser structuring we generate ultra-small trace widths on thermoplastic or ceramic 3D circuit carriers, and we also generate microstructures in metals.

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Chemical and galvanic metal deposition

For selective metalization of different substrate materials with wet-chemical processes, MIDs can be coated with copper, nickel, and gold, in our metalization line with the typical outside-electroless layer system.

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Dr.

Wolfgang Eberhardt

+49 711 685 83717 Contact

Competences

  • Molded interconnect devices (MID)
  • Electroless plating
  • Electroplating
  • Foil-based circuit carriers
  • 3D electronics

PVD technology

We apply metal layers and layer systems on different base materials, primarily via physical vapor deposition (PVD) through sputtering.

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Maskless lithography

With maskless lithography, ultra-fine conductors can be realized quickly in a digital process chain, via direct exposure.

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