Molded interconnect devices enable the integration of 3D circuit paths as well as other functional structures on 3D components from different base materials. Our service range covers various MID technologies with an eye on the requirements of our customers, from development to small-batch series production.
The LPKF-LDS® process is an efficient process for laser direct structuring of molded interconnect devices. The laser-based structuring process of the circuit path layout provides a maximum degree of 3D MID design freedom and a high degree of flexibility with respect to different layout variants.read more
3D MID can be manufactured rapidly and cost-effectively using additive processes. Hahn-Schickard raises the degree of maturity from rapid prototyping to rapid manufacturing.read more
Due to their high mechanical, thermal, and chemical robustness, thermosets open up new 3D MID application fields, particularly in automotives and in medical technology.read more
Ceramic materials extend our material portfolio for 3D interconnect devices. Similar to the LPKF-LDS® process, the conductor pattern is transferred onto the ceramics using laser structuring. The conductor structures can then be deposited on this activated area in a subsequent metalization process.read more