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3D electronics + MID

With the integration of functions in 3D, MID technologies enable the design of 3D electronic assemblies

Molded interconnect devices enable the integration of 3D circuit paths as well as other functional structures on 3D components from different base materials. Our service range covers various MID technologies with an eye on the requirements of our customers, from development to small-batch series production.

LPKF-LDS MID

The LPKF-LDS® process is an efficient process for laser direct structuring of molded interconnect devices. The laser-based structuring process of the circuit path layout provides a maximum degree of 3D MID design freedom and a high degree of flexibility with respect to different layout variants.

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Rapid prototyping of MID

3D MID can be manufactured rapidly and cost-effectively using additive processes. Hahn-Schickard raises the degree of maturity from rapid prototyping to rapid manufacturing.

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Dr.

Wolfgang Eberhardt

+49 711 685 83717 Contact

Competences

  • Molded interconnect devices (MID)
  • Electroless plating
  • Electroplating
  • Foil-based circuit carriers
  • 3D electronics

3D interconnect device from thermoset

Due to their high mechanical, thermal, and chemical robustness, thermosets open up new 3D MID application fields, particularly in automotives and in medical technology.

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3D interconnect device from ceramics

Ceramic materials extend our material portfolio for 3D interconnect devices. Similar to the LPKF-LDS® process, the conductor pattern is transferred onto the ceramics using laser structuring. The conductor structures can then be deposited on this activated area in a subsequent metalization process.

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2C-MID

The two-component injection molding process provides a variety of options for manufacturing miniaturized 3D interconnect devices. Two-component injection molding is often the process of choice for large-scale production.

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