Skip to main content

Are you looking for something?

Microassembly + packaging

Full-service provider of 3D-MID prototypes and small series

We implement customer-specific solutions for the micromounting and packing of miniaturized components, and also develop processes that we transfer once they are ready to be applied. In addition to integrated circuit packaging technology for SMDs, chips, sensors, and optoelectronic components, we also offer leading-edge technologies for packaging miniaturized systems.