Standard processes in silicon technology

In our own clean room, Hahn-Schickard offers individual or combined microsystem process steps, also as standardized processes. These process steps are further developed for special customer requirements as needed.

The plant equipment makes all silicon micromechanics processes available as stable and qualified standard processes. The processes are consistently implemented and documented in accordance with ISO 9001:2015. The most important processes are: PVD, LPCVD, PECVD, CVD, thermal oxidation, dry etching (RIE, DRIE), lithography, wet chemical processes, wafer bonding, electrical final inspection, automatic optical inspection (AOI) and wafer dicing.

All processes from development on through to series production are executed in accordance with ISO 9001:2015. Product-specific extensions of the quality standard have already been established in the past for customers in the medical technology, automotive and aerospace industries.

In the ISO class 4-7 clean room, Hahn-Schickard operates a complete silicon production line for 100 mm and 150 mm wafers with a back-end area for the integrated circuit packaging technology; in some cases the processes are possible to 200 mm. All silicon micromechanics technologies are available in our clean room as stable and qualified standard processes. Collectively these standard processes are basis for component-specific process sequences for the manufacturing of micromechanical components. I would be pleased to respond to any questions you might have.

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