Selective metalization of thermosets extends the material portfolio for 3D MID
Due to their high mechanical, thermal, and chemical robustness, thermosets open up new application fields of 3D MID, particularly in automotives and in medical technology.
Encapsulation of electronic modules or sensor components with thermoplastics for protection against mechanical stresses and environmental influences has been a standardized process for years. The thermoset components are formed via conventional injection molding or transfer molding. New processes for selective metalization now enable manufacturing 3D circuit paths on thermosetting assemblies. The result is a further functionalization of the component surface, which offers advantages in the course of the constantly progressing miniaturization of assemblies.
Processes for 3D circuit paths
Building on our many years of expertise in laser structuring and metalization of thermoplastic 3D MID, we are working on an innovative laser-based process for selective outside-currentless metalization of thermosets. The process is similar to the LPKF-LDS® process, which is widely used for thermoplastics, but it does not require any materials with special additives. For the design of 2.5D circuit paths, we apply digital printing techniques, such as ink-jet or aerosol jet, to print metal structures made of silver directly onto thermosetting components.