Two-component injection molding MID technology
Two-component injection molding is the process of choice for the production of miniaturized 3D interconnect devices, especially for large series volumes. The structuring of the conductor pattern is already done in the injection molding process.
With 2-shot MID technology, in the first shot as a rule a thermoplastic that can be metalized (e.g., core-catalyzed LCP) is processed; whereby the circuit path geometry of the 3D MID is mapped. In the second shot, the areas between the circuit path structures are encapsulated with a non-metalizable thermoplastic, through which the 3D MID gets its final form. Basically the sequence of the processed components can however be reversed.
Short process chain for 2-shot MID technology
Subsequently the selected metalization of the circuit path structures occurs. Because the conductive pattern is structured during the injection molding process, 2-shot MID technology is characterized by a short process chain.
Key factor: surface micro-roughness
The selectivity of metalization is achieved by means of targeted roughening and modifying of the plastic surface of the metalizable component using a wet-chemical pretreatment process. During this process, catalyst germs are released for the metal deposition without external power. Afterwards, the selective outside-currentless metal deposition takes place. On the foundation of a copper layer, we offer various surface metalizations, such as nickel/gold (ENIG) or silver.