Process chain for 3D interconnect devices from ceramics
Selective metalization of ceramic interconnect devices
Ceramic materials extend our material portfolio for 3D interconnect devices. Similar to the LPKF-LDS® process, the conductor pattern is transferred onto the ceramics using laser structuring. The conductor structures can then be deposited on this activated area in a subsequent metalization process.
The innovative laser-based process enables selective metalization of ceramics on the basis of aluminum oxide or aluminum nitride. Materials with special additives are not required for the process. The ceramic interconnect device is shaped using conventional ceramic injection molding, for example. To functionalize the ceramic substrates as 3D interconnect devices, the conductive pattern is structured onto the component surface using a 3D scanning laser system. This selectively activates the surface for the subsequent outside-currentless metalization. A typical layer system consists of copper, nickel, and gold. Afterwards, mounting with SMD modules is possible.
From ceramic feedstock up to 3D interconnect devices
In collaboration with the Institut für Fertigungstechnologie keramischer Bauteile (IFKB, Institute for Production Technology of Ceramic Components) of the University Stuttgart, we offer you the complete process chain from a single source: from manufacturing the ceramic feedstock, 3D forming and sintering of the ceramics via structuring and metalization up to mounting with SMD components. Given our long-standing experience, we can address your individual requirements in a targeted way.