Standard processes + services
Hahn-Schickard also offers single or combined microsystem engineering process steps in its own clean room as standardized services.
In its ISO class 4-7 clean room, over a total surface area of 1200 m², Hahn-Schickard operates a complete silicon production line for 100 mm and 150 mm wafers (in some instances up to 200 mm). The plant equipment makes all silicon micromechanics processes available as stable and qualified standard processes. The processes are consistently implemented and documented in accordance with ISO 9001:2015. The most important processes are: PVD, LPCVD, PECVD, CVD, thermal oxidation, dry etching (RIE, DRIE), lithography, wet-chemical processes, wafer bonding, electrical final inspection, automatic inspection (AOI) and wafer dicing.
Production of microsystems
All processes from development on through to series production are executed in accordance with ISO 9001:2015. Product-specific extensions of the quality standard have already been established in the past for customers in the medical technology, automotive and aerospace industries.
All technological processes for silicon micromechanics are provided in our clean room as qualified standard processes. In our production, these form the basis for component-specific process sequences for manufacturing micromechanical components.
