Back-end processes: Joining technology and support in setting up finished modules

We transform microtechnical and microelectronic components into functional ICs, sensors and finished modules.

Our back-end processes are diverse: In addition to the actual bonding and assembly of components, we also offer a variety of special solutions: for example, for medical devices.

To assemble functioning modules and sensors, we offer the following processing steps: The chips are precisely positioned and secured. Wire-bonding technology is used to perform the bonding. Methods such as wedge-wedge bonds or ball-wedge bonds can be used here  (see wire bonding).  Mounting technology via the flip-chip technique is also offered as an alternative. If necessary, the components are sealed with a glob top. The modules or sensors can also be assembled in a special casing if desired. Even laser-based processes such as the transmission welding of plastic can be applied for encapsulation.

Developing of New Joining Methods

Over time, we have accumulated lots of experience by assembling many different components, sensors and actuators and can offer you this as focused expertise. Beyond that we also advance the development of new bonding methods, such as joining with reactive multi-layers or liquid-phase sintering (TLP bonding). These technologies can generally be used for components and wafers. However, each individual case must be analyzed to determine the bond's suitability for a specific product. Take a look at the product reports and publications to discover the latest development trends.

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