Maskless lithography for ultra-fine lines

Maskless lithography via direct exposure enables fast implementation of ultra-fine lines in a digital process chain, on mechanically flexible, film substrates, and also on rigid substrates, such as ceramic substrates.

Application of the photostructured layers can occur either through application of a liquid photoresist coat (e.g., via conformal coating) or by laminating a dry film resist. In this case structuring occurs with a direct exposure unit. UV-LEDs with a high-resolution exposure projector allow a structure resolution of under 25 μm. This maskless process enables an extremely flexible layout design and it is possible to react flexibly to substrate-related warping.

After development of the photostructured layer, additional wet processes occur to generate the ultra-fine lines. Here galvanic processes are used.