Electronic encapsulation in mounting and connection technology

In modern applications, device electronics and their corresponding sensors are exposed to high mechanical, thermal and chemical stress. We develop new solutions so that electronic components function reliably.

In recent years, the use of free-flowing thermoset materials has significantly become more important for electronic encapsulation. In many application areas, this involves encapsulating the electronics with epoxy-molding compounds (EMC). In the plastics processing industry, prototypes as well as series parts are custom-produced according to each customer's demands. Here we combine our knowledge in the field of tool manufacturing with our in-depth expertise in thermoset processing. Thanks to our extensive machine park we can offer everything from a single source.

Robust and cost-effective encapsulation

Our expertise in electronic encapsulation has been successfully applied in various public and industrial projects with the goal of providing robust and cost-effective encapsulation. Hahn-Schickard has many years of experience and comprehensive knowledge in such fields as precision tool making, micro injection molding, modeling, reliability and analytics, as well as mounting and connection technology made from microtechnical components.

Our expertise lies in the integrated processing of all development, tool making, machining and production steps, and in our many years of accumulated technical knowledge in the plastic-compliant design of their components.

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