Low-stress assembly of micro systems for high temperature applications using TLP-bonding (Sensor-TLP)

Transient liquid phase (TLP) bonding is a novel attachment method for high temperature applications. In cooperation with the University of Freiburg, TLP-bonding is investigated with emphasis on low-stress assembly and hermetic sealing for micro system applications on chip-level as well as on wafer-level.

Transient liquid phase (TLP) bonding is a novel attachment method for high temperature applications. In cooperation with the University of Freiburg, TLP-bonding is investigated with emphasis on low-stress assembly and hermetic sealing for micro system applications on chip-level as well as on wafer-level.

Main activities are:

• Development of multilayer-systems for TLP-bonding
• Developing the process technology for TLP-bonding
• Characterization of bond strength and quality
• Developing of wafer level processes for TLP-bonding
• Simulation and modeling
• Verification by means of working prototypes