Pilot Factory for 3D High Precision MID Assemblies (3D-HiPMAS)

3D-HiPMAS targets on improving MID technology and developing of a pilot line for manufacturing of 3D high precision MID Assemblies for different branches.

3D-HiPMAS targets on improving MID technology and developing of a pilot line for manufacturing of 3D high precision MID Assemblies for different branches. 3D-HiPMAS addresses the following topics:

• Improved LDS thermoplastics (fine pitch, CTE, thermal conductivity) and injection molding
• Laser structuring and electroless metal plating processes Cu/Ag and Cu/Pd/Au for 70 µm pitch in 2D and 150 µm pitch in 3D
• 3D assembly processes (dispensing, SMD- and chip assembly, laser soldering)
• Machinery: Fine focus laser system (20 µm), 3D assembly OurPlant, X-ray inspection
• Technology verification on 4 demonstrators from different branches

1. Medical technology
2. Energy
3. Automotive
4. Information and communication

• Exploitation of other branches e.g. toys
• Pilot line for 3D-HiPMAS technology at Hahn-Schickard Stuttgart