Pilot Factory for 3D High Precision MID Assemblies (3D-HiPMAS)
3D-HiPMAS targets on improving MID technology and developing of a pilot line for manufacturing of 3D high precision MID Assemblies for different branches.
3D-HiPMAS targets on improving MID technology and developing of a pilot line for manufacturing of 3D high precision MID Assemblies for different branches. 3D-HiPMAS addresses the following topics:
- Improved LDS thermoplastics (fine pitch, CTE, thermal conductivity) and injection molding
- Laser structuring and electroless metal plating processes Cu/Ag and Cu/Pd/Au for 70 µm pitch in 2D and 150 µm pitch in 3D
- 3D assembly processes (dispensing, SMD- and chip assembly, laser soldering)
- Machinery: Fine focus laser system (20 µm), 3D assembly OurPlant, X-ray inspection
- Technology verification on 4 demonstrators from different branches
- Medical technology
- Energy
- Automotive
- Information and communication
- Exploitation of other branches e.g. toys
- Pilot line for 3D-HiPMAS technology at Hahn-Schickard Stuttgart
- Funding Number
- 314293
- Duration
- 01.10.2012 to 30.09.2015
- Maturity Level
-
Prototype