Jahr | Name |
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2019 |
Challenges in the Fabrication of Microstructured Polymer OpticsM. Roeder, P. Schilling, K.-P. Fritz, T. Guenther, A. Zimmermann Journal of Micro- and Nano-Manufacturing; JUNE 2019, Vol. 7 / 021001-1, [DOI: 10.1115/1.4044219], pp. 1-6, Project AiF-RP-No. 18556 N und Project InnBW IDAK show abstractThe fabrication of microstructured polymer optics enables a multitude of new options in the design of technical optics. However, challenges arise along the varying process chains of mold insert fabrication, integration into molding tools, replication by means of injection compression molding and metrology. In order to study the effects, diffractive optical elements (DOE) and microlens arrays (MLA) are fabricated using two different process chains. DOEs are fabricated using a laser direct writing (LDW) based mold insert fabrication. The MLA mold insert is produced using ultra-precision milling (UPmilling). Both optical parts are replicated using injection compression molding. The occurring effects are discussed and the results show, that with complete process control high quality microstructured polymer optical parts can be produced and characterized. |
2019 |
Fabrication of curved diffractive optical elements by means of laser direct writing, electroplating, and injection compression moldingM. Roeder, S. Thiele, D. Hera, C. Pruss, T. Guenther, W. Osten, A. Zimmermann Journal of Manufacturing ProcessesVolume 47, November 2019, pp. 402-409, Project AiF-RP-No. 18556 N show abstractIn this work, a new process chain for the fabrication of curved micro-structured optical elements by injection compression molding is investigated. The fabrication is demonstrated for the example of a curved diffractive optical element (DOE). In a first process step a master substrate is fabricated using laser direct writing on a curved glass substrate. Blazed diffractive micro-structures with lateral feature sizes down to 5 μm and height of 1.6 μm are created. A subsequent electroplating process is applied to create a nickel stamper to be used as a tool insert for the molding process. During electroplating, a 3 mm nickel layer is formed, transferring the diffractive structures from the master substrate into a solid mold insert. The nickel stamper shows an accurate reproduction of the micro-structures. The mold insert is integrated into an injection compression molding tool to replicate the optical elements. Results show that the blazed diffractive structures are replicated with a high quality. Tests of the components within a chromatic-confocal measurement setup confirm that they can potentially replace expensive conventional elements. |
2019 |
Review on Fabrication Technologies for OpticalMold InsertsM. Roeder, T. Guenther, A. Zimmermann Micromachines 2019, 10, 233; doi:10.3390/mi10040233, pp. 1-25, Project AiF-RP-No. 18556 N und Project InnBW IDAK show abstractPolymer optics have gained increasing importance in recent years. With advancing requirements for the optical components, the fabrication process remains a challenge. In particular, the fabrication of the mold inserts for the replication process is crucial for obtaining high-quality optical components. This review focuses on fabrication technologies for optical mold inserts. Thereby, two main types of technologies can be distinguished: fabrication methods to create mold inserts with optical surface quality and methods to create optical microstructures. Since optical mold inserts usually require outstanding form accuracies and surface qualities, a focus is placed on these factors. This review aims to give an overview of available methods as well as support the selection process when a fabrication technology is needed for a defined application. Furthermore, references are given to detailed descriptions of each technology if a deeper understanding of the processes is required. |
2019 |
Laser Irradiation for Improving the Wetting of Nanoparticle Gold Inks for Printed ElectronicsD. Juric, H. Hao, E. Ermantraut, K. Gläser, W. Eberhardt, A. Zimmermann IEEE Transactions on Components Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2019.2947414 |
2019 |
Challenges in soldering on inkjet-printed structuresD. Juric, S. Hämmerle, K. Gläser, W. Eberhardt, A. Zimmermann Fachmesse und Kongress für gedruckte Elektronik (LOPEC), 19.-21.3.2019, München |
2019 |
Assembly of multiple ultra-thin chips on flexible foils with high placement accuracy by a simple transfer processF. Janek, S. Weser, M. Barth, W. Eberhardt, A. Zimmermann IEEE Transaction on Components, Packaging and Manufacturing Technology, November 2019 Volume 9, Number 11, ITCPC8,ISSN 2156-3950, pp. 2314 -2319 show abstractThis paper presents a simple approach for high accuracy assembly of multiple ultra-thin chips on flexible foil substrates. The chips are placed initially in cavities on a chip carrier substrate and transferred onto a thermally releasable adhesive tape. After application of epoxy-based adhesive onto the chip surface the chips are transferred onto the foil substrate. Finally, the epoxy adhesive is cured and the adhesive tape is removed. It was found that a wafer dicing tape with releasing temperature of 90 °C as thermally releasable adhesive tape and a two-component epoxy adhesive with a curing temperature of 65 °C is suitable for the process. High placement accuracy of the chips of less than 30 µm in x- and y- orientation as well as rotational misalignment lower than 0.2° was obtained. The process is demonstrated on polyimide foil with a resulting chip flatness of ± 5 µm. |
2019 |
A Product Development Approach in The Field of Micro-Assembly with Emphasis on Conceptual DesignC. Gielisch, K.-P. Fritz, A. Noack, A. Zimmermann Applied Sciences, 2019, 9. Jg., Nr. 9, pp. 1920 - 1937, 02P15A120 show abstractFaster product lifecycles make long-term investments in machines for micro assembly riskier. Therefore, reconfigurable manufacturing systems gain more and more attention. But most companies are uncertain if a reconfigurable manufacturing system can fulfill their needs and justify the initial investment. New and improved techniques for product development have the potential to foster the utilization and decrease the investment risk for such systems. In this paper, four different methods for product development are reviewed. A set of criteria regarding micro assembly on reconfigurable manufacturing systems RMS is established. Based on those criteria and the assessment, a novel approach for a product development method is provided, which tries to combine the strengths of the beforehand presented approaches. It focuses on the conceptual design phase to overcome the customers’ uncertainty in the development process. For this, an abstract representation of a micro-assembly product idea as well as a decision tree for joining processes are established and validated by real product ideas using expert interviews. The validation shows that the conceptual design phase can be used as a useful tool in the product development process in the field of micro assembly. |
2019 |
Assembly of Components on Inkjet-Printed Silver Structures by SolderingD. Juric, S. Hämmerle, K. Gläser, W. Eberhardt, A. Zimmermann IEEE Transactions on Components Packaging and Manufacturing Technology, pp. 156-162, DOI: 10.1109/TCPMT.2018.2855045 |
2019 |
MedAssembly – Forschungs- und Transferzentrum für mikromedizinische FertigungS. Herrlich Regioforum Schwarzwald-Baar-Heuberg – Perspektive 2030, 30.01.2019, Tuttlingen, Germany |
2019 |
Linking regional and European DIH activities – example Baden-WürttembergS. Karmann 6th Meeting of the European Commission‘s Work Group on DIH, 3. April 2019, Brüssel, Belgien show abstractSeveral European projects on Digital Innovation Hubs (DIHs) have developed their own platforms or marketplaces, offering solutions for companies to improve their production processes, products or business models with digital technologies. These marketplaces have a high potential to make a real difference for companies, but how to make the most out of them? The aim of the meeting is to bring together Digital Innovation Hubs representatives, who are part of the European Catalogue of DIHs and who are part of the Working Group on Digital Innovation Hubs, to explore:
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2019 |
A technology platform for in vitro transcription and translation of enzymes in micro compartmentsSilvia Calabrese Enzyme Engineering XXV, 15.-19.09.2019, Whistler ResortWhistler, British Columbia/Kanada |
2017 |
Integriertes System zur simultanen Detektion von Krankenhauskeimen und deren Antibiotikaresistenzen auf EinzelzellebeneN. Borst, M. Specht, M. Schulz, N. Paust, J. Li, S. Wadle, U. Götz, E. Held-Föhn, A. Heiß, F. Hausladen, R. Mader, K. Stock, M. Röder, A. Serr, G. Häcker, R. Zengerle, F. von Stetten 2017 MST Kongress 23. – 25. Oktober 2017, München |
2018 |
Analysis of the metallic structure of microspheres produced by printing of aluminum alloys from the liquid meltB. Gerdes, M. Breitwieser, T. Kaltenbach, M. Jehle, J. Wilde, R. Zengerle, P. Koltay, L. Riegger 2018 Materials Research Express …., doi: 10.1088/2053-1591/aaf3bf |
2018 |
Membrane-based sample inlet for centrifugal microfluidic cartridgesS. Hin, M. Loskyll, V. Klein, M. Keller, O. Strohmeier, F. von Stetten, R. Zengerle, K. Mitsakakis 2018 Microelectron. Eng., 187; 78-83, doi: 10.1016/j.mee.2017.12.006 |
2018 |
Converging Human and Malaria Vector Diagnostics with Data Management towards an Integrated Holistic One Health ApproachK. Mitsakakis, S. Hin, P. Müller, N. Wipf, E. Thomsen, M. Coleman, R. Zengerle, J. Vontas, K. Mavridis 2018 Int. J. Envir. Res. Publ. Health 15 (2), 259 |
2018 |
Diagnostic tools for tackling febrile illness and enhancing patient managementK. Mitsakakis, V. D’Acremont, S. Hin, F. Stetten, R. Zengerle 2018 Microelectron. Eng., 201; 26-59, doi: 10.1016/j.mee.2018.10.001. |
2018 |
Fluorescence signal-to-noise optimisation for real-time PCR using universal reporter oligonucleotidesM. Lehnert, E. Kipf, F. Schlenker, N. Borst, R. Zengerle, F. von Stetten 2018 Anal. Meth. …, doi: 10.1039/c8ay00812d |
2018 |
Digital hydraulic drive for microfluidics and miniaturized cell culture devices based on shape memory alloy actuatorsC.H. Tsai, X. Wu, D.H. Kuan, S. Zimmermann, R. Zengerle, P. Koltay 2018 J Micromech Microeng 28, 084001, doi: 10.1088/1361-6439/aabd1e |
2018 |
Fabrication of 3D Ceramic Interconnect Devices by Laser Induced Selective MetallizationE. Ermantraut, A. Zimmermann, H. Müller, M. Wolf, W. Eberhardt, P. Ninz, F. Kern, R. Gadow 2018 Smart Systems Integration, 11.-12.04.2018, Dresden |
2018 |
Rapid Prototyping von Molded Interconnect Devices (MID)H. Müller, T. Meißner, T. Grözinger, T. Vieten, M. Soltani, W. Eberhardt, A. Zimmermann 2018 10. Innovationsforum Smarte Technologien & Systeme, 15.03.2018, Donaueschingen |