Jahr Name
2019

Mikrotechnisch hergestelltes 3D-Lorenzkraft-Magnetometer Sensorelement (3DLKM) mit neuartigem multiaxialem Betriebsprinzip und neuartigem Ausleseverfahren

J. Rockstroh, D. Krawat

Abschlussbericht IGF-Vorhaben-Nr.: 18631 N

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2019

An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages

R. Kulkarni, P. Wappler, M. Soltani, M. Haybat, T. Guenther, T. Groezinger, A. Zimmermann

Journal of Manufacturing and Materials Processing (ISSN 2504-4494)

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An ever-growing market demand for board (second) level packages (e.g., embedded systems, system-on-a-chip, etc.) poses newer challenges for its manufacturing industry in terms of competitive pricing, higher reliability, and overall dimensions. Such packages are encapsulated for various reasons including thermal management, protection from environmental conditions and dust particles, and enhancing the mechanical stability. In the due course of reducing overall sizes and material saving, an encapsulation as thin as possible imposes its own significance. Such a thin-walled conformal encapsulation serves as an added advantage by reducing the thermo-mechanical stresses occurring due to thermal-cyclic loading, compared to block-sized or thicker encapsulations. This paper assesses the encapsulation process of a board-level package by means of thermoset injection molding. Various aspects reviewed in this paper include the conception of a demonstrator, investigation of the flow simulation of the injection molding process, execution of molding trials with different encapsulation thicknesses, and characterization of the packages. The process shows a high dependence on the substrate properties, injection molding process parameters, device mounting tolerances, and device geometry tolerances. Nevertheless, the thermoset injection molding process is suitable for the encapsulation of board-level packages limiting itself only with respect to the thickness of the encapsulation material, which depends on other external aforementioned factors.


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2019

Optimized Micro-Mounting and Hybrid Integration of RF Mixed-Signal Systems based on MID Technology, Smart Systems Integration

M. Wolf, M. Barth, W. Eberhardt, A. Zimmermann, V. Geneiß, C. Hedayat, T. Otto

Barcelona, VDE Verlag GmbH, 10.-11.4.2019, pp. 383 - 386

2019

Challenges in the Fabrication of Microstructured Polymer Optics

M. Roeder, P. Schilling, K.-P. Fritz, T. Guenther, A. Zimmermann

Journal of Micro- and Nano-Manufacturing; JUNE 2019, Vol. 7 / 021001-1, [DOI: 10.1115/1.4044219], pp. 1-6, Project AiF-RP-No. 18556 N und Project InnBW IDAK

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The fabrication of microstructured polymer optics enables a multitude of new options in the design of technical optics. However, challenges arise along the varying process chains of mold insert fabrication, integration into molding tools, replication by means of injection compression molding and metrology. In order to study the effects, diffractive optical elements (DOE) and microlens arrays (MLA) are fabricated using two different process chains. DOEs are fabricated using a laser direct writing (LDW) based mold insert fabrication. The MLA mold insert is produced using ultra-precision milling (UPmilling). Both optical parts are replicated using injection compression molding. The occurring effects are discussed and the results show, that with complete process control high quality microstructured polymer optical parts can be produced and characterized.


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2019

Fabrication of curved diffractive optical elements by means of laser direct writing, electroplating, and injection compression molding

M. Roeder, S. Thiele, D. Hera, C. Pruss, T. Guenther, W. Osten, A. Zimmermann

Journal of Manufacturing ProcessesVolume 47, November 2019, pp. 402-409, Project AiF-RP-No. 18556 N

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In this work, a new process chain for the fabrication of curved micro-structured optical elements by injection compression molding is investigated. The fabrication is demonstrated for the example of a curved diffractive optical element (DOE). In a first process step a master substrate is fabricated using laser direct writing on a curved glass substrate. Blazed diffractive micro-structures with lateral feature sizes down to 5 μm and height of 1.6 μm are created. A subsequent electroplating process is applied to create a nickel stamper to be used as a tool insert for the molding process. During electroplating, a 3 mm nickel layer is formed, transferring the diffractive structures from the master substrate into a solid mold insert. The nickel stamper shows an accurate reproduction of the micro-structures. The mold insert is integrated into an injection compression molding tool to replicate the optical elements. Results show that the blazed diffractive structures are replicated with a high quality. Tests of the components within a chromatic-confocal measurement setup confirm that they can potentially replace expensive conventional elements.


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2019

Review on Fabrication Technologies for OpticalMold Inserts

M. Roeder, T. Guenther, A. Zimmermann

Micromachines 2019, 10, 233; doi:10.3390/mi10040233, pp. 1-25, Project AiF-RP-No. 18556 N und Project InnBW IDAK

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Polymer optics have gained increasing importance in recent years. With advancing requirements for the optical components, the fabrication process remains a challenge. In particular, the fabrication of the mold inserts for the replication process is crucial for obtaining high-quality optical components. This review focuses on fabrication technologies for optical mold inserts. Thereby, two main types of technologies can be distinguished: fabrication methods to create mold inserts with optical surface quality and methods to create optical microstructures. Since optical mold inserts usually require outstanding form accuracies and surface qualities, a focus is placed on these factors. This review aims to give an overview of available methods as well as support the selection process when a fabrication technology is needed for a defined application. Furthermore, references are given to detailed descriptions of each technology if a deeper understanding of the processes is required.


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2019

Aushärteprozess für Klebeverbindungen mit dünnen und homo-genen Klebespalten bei ultradünnen Chips auf Foliensubstraten

Florian Janek, E. Müller, M. Barth, T. Vieten, S. Weser, W. Eberhardt, A. Zimmermann

microTEC Südwest Clusterkonferenz 2019, 20.03.2019 - 21.03.2019, Konzerthaus Freiburg

2019

Laser Irradiation for Improving the Wetting of Nanoparticle Gold Inks for Printed Electronics

D. Juric, H. Hao, E. Ermantraut, K. Gläser, W. Eberhardt, A. Zimmermann

IEEE Transactions on Components Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2019.2947414

2019

Challenges in soldering on inkjet-printed structures

D. Juric, S. Hämmerle, K. Gläser, W. Eberhardt, A. Zimmermann

Fachmesse und Kongress für gedruckte Elektronik (LOPEC), 19.-21.3.2019, München

2019

Projektatlas Kompetenz Montage (Inhaltlicher Abschlussbericht MIKROKOMO)

C. Gielisch, M. Körner und A. Zimmermann

ISBN13: 978-3-948169-06-0, Abschlussbericht 02P15A120

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Deutschland ist im Weltmaßstab eine bedeutende Industrienation. Bei der Herstellung komplexer Industriegüter hat die Montage einen entscheidenden Anteil an der Wertschöpfung. Vor diesem Hintergrund hat das Bundesministerium für Bildung und Forschung (BMBF) im Jahr 2015 den Ideenwettbewerb „Kompetenz Montage – kollaborativ und wandlungsfähig“ ausgerufen. Wissenschaft und Praxis haben in dreijährigen gemeinsamen Forschungs- und Entwicklungsaktivitäten viele neue Systemlösungen für die Montageerarbeitet. Dabei war es den 80 Projektpartnern ein besonderes Anliegen, ihre Ergebnisse direkt in der betrieblichen Praxis auf ihre Tauglichkeit zu überprüfen. Der vorliegende Projektatlas bereitet die Ergebnisse in einer neuartigen, anschaulichen Form auf. Mit dem Format des „Atlas“ wird der Versuch unternommen, alle Aspekte der Montageautomatisierung aus dem jeweiligen Blickwinkel verschiedener betrieblicher Akteure zu betrachten. Der Atlas wendet sich damit vor allem an Management, Betriebsrat, Arbeitsplanung, Arbeitssicherheitsverantwortliche, Controlling, Produktionsleitung, Personalplanung und Fachkräfte in der Montage. Damit die Gestaltung zukünftiger Montagesysteme ein Erfolg wird, sollten möglichst alle relevanten Personengruppen angemessen beteiligt werden. Wie dies gelingt, zeigen wir in den einzelnen Kapiteln des Atlas.


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2019

Projektvorstellung Mikrokomo

C. Gielisch

MOTEK 2019, 07.-10.10.2019, Stuttgart, 02P15A120

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Vorstellung des Mikrokomo-Projektes vor Fachpublikum auf der MOTEK 2019

2019

Wandlungsfähige Montage gezielt planen

C. Gielisch, M. Barth

MICROvent GmbH, mikroproduktion 05/19, ISSN 1614-4538, pp. 28 - 32, 02P15A120

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Modulare Anlagen sparen Zeit und Kosten. Die Randbedingungen der Anlagentechnik sollten jedoch bereits beim Produktdesign berücksichtigt werden. Das Forschungsprojekt >Mikrokomo< sucht nach Wegen für eine fertigungsgerechte Planung und Entwicklung.

 

2019

Assembly of multiple ultra-thin chips on flexible foils with high placement accuracy by a simple transfer process

F. Janek, S. Weser, M. Barth, W. Eberhardt, A. Zimmermann

IEEE Transaction on Components, Packaging and Manufacturing Technology, November 2019 Volume 9, Number 11, ITCPC8,ISSN 2156-3950, pp. 2314 -2319

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This paper presents a simple approach for high accuracy assembly of multiple ultra-thin chips on flexible foil substrates. The chips are placed initially in cavities on a chip carrier substrate and transferred onto a thermally releasable adhesive tape. After application of epoxy-based adhesive onto the chip surface the chips are transferred onto the foil substrate. Finally, the epoxy adhesive is cured and the adhesive tape is removed. It was found that a wafer dicing tape with releasing temperature of 90 °C as thermally releasable adhesive tape and a two-component epoxy adhesive with a curing temperature of 65 °C is suitable for the process.  High placement accuracy of the chips of less than 30  µm in x- and y- orientation as well as rotational misalignment lower than 0.2° was obtained. The process is demonstrated on polyimide foil with a resulting chip flatness of ± 5 µm.


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2019

A Product Development Approach in The Field of Micro-Assembly with Emphasis on Conceptual Design

C. Gielisch, K.-P. Fritz, A. Noack, A. Zimmermann

Applied Sciences, 2019, 9. Jg., Nr. 9, pp. 1920 - 1937, 02P15A120

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Faster product lifecycles make long-term investments in machines for micro assembly riskier. Therefore, reconfigurable manufacturing systems gain more and more attention. But most companies are uncertain if a reconfigurable manufacturing system can fulfill their needs and justify the initial investment. New and improved techniques for product development have the potential to foster the utilization and decrease the investment risk for such systems. In this paper, four different methods for product development are reviewed. A set of criteria regarding micro assembly on reconfigurable manufacturing systems RMS is established. Based on those criteria and the assessment, a novel approach for a product development method is provided, which tries to combine the strengths of the beforehand presented approaches. It focuses on the conceptual design phase to overcome the customers’ uncertainty in the development process. For this, an abstract representation of a micro-assembly product idea as well as a decision tree for joining processes are established and validated by real product ideas using expert interviews. The validation shows that the conceptual design phase can be used as a useful tool in the product development process in the field of micro assembly.
 

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2019

Räumliche Schaltungsträger und folienbasierte Systeme für die Medizintechnik

M. Barth

6. GMM Workshop Packaging von Mikrosystemen PackMEMS 2019, 29.3.2019, Berlin

2019

Assembly of Components on Inkjet-Printed Silver Structures by Soldering

D. Juric, S. Hämmerle, K. Gläser, W. Eberhardt, A. Zimmermann

IEEE Transactions on Components Packaging and Manufacturing Technology, pp. 156-162, DOI: 10.1109/TCPMT.2018.2855045

2019

MedAssembly – Forschungs- und Transferzentrum für mikromedizinische Fertigung

S. Herrlich

Regioforum Schwarzwald-Baar-Heuberg – Perspektive 2030, 30.01.2019, Tuttlingen

2019

Linking regional and European DIH activities – example Baden-Württemberg

S. Karmann

6th Meeting of the European Commission‘s Work Group on DIH, 3. April 2019, Brüssel, Belgien

Kurzfassung einblenden

Several European projects on Digital Innovation Hubs (DIHs) have developed their own platforms or marketplaces, offering solutions for companies to improve their production processes, products or business models with digital technologies.

These marketplaces have a high potential to make a real difference for companies, but how to make the most out of them?

The aim of the meeting is to bring together Digital Innovation Hubs representatives, who are part of the European Catalogue of DIHs and who are part of the Working Group on Digital Innovation Hubs, to explore:

  • What marketplaces and platforms exist and how could they be grouped together?
  • How regions could benefit from them for their own companies?
  • How Digital Innovation Hubs could be the main distributors of the portfolio of tools developed by EU-funded Innovation Actions at regional level?
2018

Synthesis and characterization of Halar® polymer coating deposited on titanium substrate by electrophoretic deposition process

N. Bosh, L. Deggelmann, C. Blattert, H. Mozaffari, C. Müller

Surface & Coatings Technology 347, 2018. 369–378 pp.

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2019

Pilotlinie zur Fertigung von Einmal-Testträgern für die In-Vitro-Diagnostik

R. Streller

Innovationsforum Technology Mountains, Donaueschingen, 14.03.2019