Jahr Name
2021

Substitution metallischer Gehäuse durch Duroplastverkapselung elektronischer Baugruppen

Romit Kulkarni, Simon Petillon, Mehmet Haybat, Tobias Grözinger, Andrea Knöller, Serhat Sahakalkan, Thomas Günther, Karl-Peter Fritz, Wolfgang Eberhardt, André Zimmermann

PLUS - Elektronikfertigung

Kurzfassung einblenden

Elektronische Baugruppen werden in der Industrietechnik oder der Kraftfahrzeugtechnik häufig unter rauen Umgebungsbedingungen betrieben und müssen daher vor Umwelteinflüssen geschützt werden. Zu diesen Umwelteinflüssen zählen neben extremen Umgebungstemperaturen auch aggressive Medien.

2021

Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen Substratmaterialien

Alexander Schilling, Philipp Ninz, Simon Petillon, Sascha Weser, Dr. Andrea Knöller, Dr. Wolfgang Eberhardt, Dr. Thomas Günther, Prof. Dr. Frank Kern und Prof. Dr. André Zimmermann

MST Kongress 2021, Ludwigsburg

Kurzfassung einblenden

Die Herstellung von dreidimensionalen Schaltungsträgern aus spritzgegossenen Thermoplasten, welche mittels Laserdirektstrukturierung und anschließender außenstromloser selektiver Metallisierung funktionalisiert werden, ist mittlerweile Stand der Technik. Bei erhöhter thermischer und/oder mechanischer Belastung z.B. durch Steigerung der elektrischen Leistungsdichte, stoßen Thermoplaste jedoch an ihre Grenzen. Hier bieten keramische Substratmaterialien klare Vorteile. Die Herstellung von solchen keramischen Schaltungsträgern mittels laserinduzierter Direktmetallisierung wurde erfolgreich realisiert. Hierfür wurden zwei Unterschiedliche Varianten an Al2O3-Keramiken untersucht. In der ersten Variante erfolgte das Sintern der Al2O3-Keramiken in H2-Atmosphäre, in Variante 2 wurden die Al2O3-Keramiken mit Cr2O3 dotiert und an Luft gesintert. Anschließend erfolgte für beide Varianten eine Laserstrukturierung mit darauffolgender außenstromloser Metallisierung. Somit ließen sich 3D-Schaltungsträger mit hoher thermischer Belastbarkeit, einer geringen Wärmeausdehnung und einer guten elektrischen Isolation herstellen. Die abgeschiedenen Metallschichten zeigten vergleichbare und zum Teil bessere Eigenschaften als solche auf klassischen thermoplastisch

2021

Tailoring Conductor Tracks – Towards Molded Interconnect Devices with Enhanced Reliability

Simon Petillon, Andrea Knöller, Philipp Bräuer, David Helm, Tobias Grözinger, Sascha Weser, Wolfgang Eberhardt, Jörg Franke, André Zimmermann

IEEE Transactions on Device and Materials Reliability

Kurzfassung einblenden

Quality and reliability are two fundamental requirements for molded interconnect devices to be able to compete with other circuit carriers in various application fields, such as automotive, sensor technology, medical technology and communication technology. In this context, especially the laser direct structuring and metallization process, which govern the adhesion between the substrate and the metal layer, along with the mechanical integrity of the conductor tracks, are considered as critical in terms of the complete circuit carriers’ performance. This study focuses on the laser direct structuring of thermoplastic LCP Vectra E840i LDS substrates and the subsequent electroless metallization of the well-established layer system Cu/Ni/Au to identify the major influencing factors for the conductor tracks’ mechanical stability, using a customized flexural fatigue test setup. For the present molded interconnect device, increasing the roughness of the laser direct structured surface as well as decreasing the nickel layer thickness, while increasing its phosphorous content led to an improvement of up to three orders of magnitude in the number of bending cycles before fracture. These results thus provide valuable design rules for molded interconnect devices with enhanced reliability

2021

Minimally Invasive Sensors for Transurethral Impedance Spectroscopy

Carina Veil, Simon Petillon, Jonas Hotz, Andrea Knöller, André Zimmermann, und Oliver Sawodny

IEEE SENSORS JOURNAL

Kurzfassung einblenden

Bladder tumor recurrence is a serious problem in urooncology, as it increases the risk of fatal progession and makes further surgeries necessary. The possibility of intraoperative tissue differentiation can help for diagnostic purposes as well as for ensuring that the entirety of the tumor is removed. The latter not only differ visually from healthy tissue, but also in their mechanical and electrical properties due to an altered physiology. A possible base for intraoperative tissue differentiation are impedance measurements, which are, however, difficult to obtain passing through the limited space of the urethra. This work presents two impedance sensors, which are obtained by laser direct structuring and rely on a four terminal measurement. The miniaturized sensors are suitable for minimally invasive usage. Circular electrodes are placed in a square for a first sensor, whereas a novel combination of one circular electrode and three concentric rings is designed for the second sensor. For each sensor, the specific geometry factor is determined and the impact of sensitivity towards small conductivity changes inside the tissue investigated. Furthermore, multiple ex vivo measurements on fresh pig bladders are carried out with each sensor. It is shown that both sensors reliably determine tissue impedance data that fit empirical tissue models. Conductivity values close to listed data of human urinary bladder are obtained. Ultimately, the novel ring sensor configuration turns out to more favorable in terms of sensitivity distribution and yields more reproducible results than the square electrode arrangement.

2020

Practical aspects and limitations of hermeticity testing of micro-encapsulations using cumulative helium leak detection for miniaturized implantable medical devices

T. Guenther, A. Schwenck, P. Matteucci, R. Leigh, M. Svehla, A. Zimmermann, G.J. Suaning

ISSN: 2156-3985, Seite – bis Seite: 351 - 359, 2020

Kurzfassung einblenden

Hermeticity of an electronic package defines its effectiveness to seal and protect the encapsulated electronics from the ingress of contaminants, gases and moisture, as well as helping avoid toxic materials from inside the capsule contacting tissue. Using accelerated testing by methods of leak detection analysis, the theoretical limit of the lifetime due to water ingress of an encapsulated device can be estimated. However, classical methods are not sufficient for micro-encapsulations and exhibit limitations due to the resolution of the detection mechanisms required for such small cavities. With the availability of cumulative helium leak detection (CHLD) the detection limits can be extended by several magnitudes of resolution. However, limitations due to the physics of leakage apply. This paper discusses the limitations concerning the ability for combined gross, and fine leak testing in combination with outgassing effects using CHLD for miniaturized implantable medical devices. Practical aspects are evaluated regarding the applicability of CHLD for such micro encapsulations at the example of an AuSn sealed alumina package.

Link to publication

2020

Surface Optimization of Micro-Integrated ReflectiveOptical Elements by Thermoset Injection Molding

T. Guenther, L. Diegel, M. Roeder, M. Drexler, M. Haybat, P. Wappler, M. Soltani, A. Zimmermann

2076-3417, 1-13, 2020

Kurzfassung einblenden

Thermoset materials offer a multitude of advantageous properties in terms of shrinkage and warpage as well as mechanical, thermal and chemical stability compared to thermoplastic materials. Thanks to these properties, thermosets are commonly used to encapsulate electronic components on a 2nd-level packaging prior to assembly by reflow soldering on printed circuits boards or other substrates. Based on the characteristics of thermosets to develop a distinct skin effect due to segregation during the molding process, the surface properties of injection molded thermoset components resemble optical characteristics. Within this study, molding parameters for thermoset components are analyzed in order to optimize the surface quality of injection molded thermoset components. Perspectively, in combination with a reflective coating by e.g., physical vapor deposition, such elements with micro-integrated reflective optical features can be used as optoelectronic components, which can be processed at medium-ranged temperatures up to 230 °C. The obtained results indicate the general feasibility since Ra values of 60 nm and below can be achieved. The main influencing parameters on surface quality were identified as the composition of filler materials and tool temperature.

Link to publication

2020

Temperature Dependence of the Steering Angles of a Silicon Photonic Optical Phased Array

PAK Yepez, U Scholz, A Zimmermann

IEEE Photonics Journal 12 (2), 1-13, 2020

2020

CMOS-compatible measures for thermal management of phase-sensitive silicon photonic systems

PA Krochin-Yepez, U Scholz, A Zimmermann

Photonics 7 (1), 6, 2020

2020

Mechanical Behavior of Polymer Derived Ceramics – A Review

S Ravindran, S Jothi, A Zimmermann, F Aldinger, R Kumar

International Materials Reviews, 2020

2020

Surface Optimization of Micro-Integrated Reflective Optical Elements by Thermoset Injection Molding

T Guenther, L Diegel, M Roeder, M Drexler, M Hybat, P Wappler

Applied Sciences 10, 4197, 2020

2020

Mechanical behaviour of polymer derived ceramics–a review

R Sujith, S Jothi, A Zimmermann, F Aldinger, R Kumar

International Materials Reviews, 1-24, 2020

2020

Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging

F. Häußler, S. Shen, S. Petillon, S. Weser, M. Haybat, W. Eberhardt, A. Zimmermann, J. Franke

International Symposium on Microelectronics (2020) 2020 (1): 000140–000145.

Kurzfassung einblenden
2020

Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices

F. Häußler, J. Dornheim, S. Petillon, W. Eberhardt, A. Zimmermann, J. Franke

2020 43rd International Spring Seminar on Electronics Technology (ISSE), Demanovska Valley, Slovakia, 2020. doi: 10.1109/ISSE49702.2020.9121136.

2020

Feasibility Study of an Automated Assembly Process for Ultrathin Chips

F. Janek, E. Saller, E. Müller, T. Meißner, S. Weser, M. Barth, W. Eberhardt, A. Zimmermann

Micromachines 2020, 11, S. 654, DOI:10.3390/mi11070654

2020

Selektive laserinduzierte Metallisierung von 3D-Schaltungsträgern aus Aluminiumoxid

F. Kern, P. Ninz, R. Gadow, W. Eberhardt, S. Petillon, A. Zimmermann

Keramische Zeitschrift, 1/2020, S. 42-47

2020

Selective laser induced autocatalytic metallization of NiO and Cr2O3 doped alumina zirconia ceramic substrates

P. Ninz, F. Kern, S. Petillon, W. Eberhardt, A. Zimmermann, R. Gadow

Journal of the European Ceramic Society, Volume 40, Issue 11, 2020, S.  3733-3743.

Kurzfassung einblenden
2020

Conceptual Planning of Micro-Assembly for a Better Utilization of Reconfigurable Manufacturing Systems

C. Gielisch. K.-P. Fritz, B. Wigger und A. Zimmermann

Applied Sciences, 10. Jg., Nr.8, pp. von Seite – bis Seite: 2806 - 2824, 2020, 02P15A120

Kurzfassung einblenden

Reconfigurable manufacturing systems (RMS) can be used to produce micro-assembled products that are too complex for assembly on flat substrates like printed circuit boards. The greatest advantage of RMS is their capability to reuse machine parts for different products, which enhances the economical efficiency of quickly changing or highly individualized products. However, often, process engineers struggle to achieve the full potential of RMS due to product designs not being suited for their given system. Guaranteeing a better fit cannot be done by static guidelines because the higher degree of freedom would make them too complex. Therefore, a new method for generating dynamic guidelines is proposed. The method consists of a model, with which designers can create a simplified assembly sequence of their product idea, and another model, with which process engineers can describe the RMS and the procedures and operations that it can offer. By combining both, a list of possible machine configurations for an RMS can be generated as an automated response for a modeled assembly sequence. With the planning tool for micro-assembly, an implementation of this method as a modern web application is shown, which uses a real existent RMS for micro-assembly.

Link to publication

2020

Low-cost microfluidic catridge for the detection of myco-toxin in food to be used in a point-of-care device

D. Walter

KET4CP SME2019-06-NO.6

Kurzfassung einblenden

This project took place in cooperation with Organska Elektronika d.o.o. and the International Iberian Nanotechnology Laboratory (INL). The company Organska Elektronika d.o.o. is developing a new system for the detection of myco-toxin in food i.e. milk. The main goals of this project were the development of a plastic catridge and the development of a portable incubator. The catridge was designed for its functionality with a simple microfluidic circuit. The middle part of the catridge can be produced by injection molding for high-volume production. Several sealing methods for the fluidic circuit were introduced. In addition a portable incubator was developed for the simultaneous use of four catridges.

Link to publication

2020

Reliability of Mechatronic Integrated Devices Regarding Failure Mechanisms

P. Bräuer, L. Wurzer, T. Kuhn, A. Knöller, H. Müller, W. Eberhardt, A. Zimmermann, J. Franke

2020 43rd International Spring Seminar on Electronics Technology (ISSE);14.-15.05.2020, geplant im Demanovska Valley (Slowakei), wegen Corona aber Online


IEEE, 19754 N (MetaZu)

Kurzfassung einblenden
2020

Mass-producible micro-optical elements by injection compression molding and focused ion beam structured titanium molding tools

Guenther, T.; Diegel, L.; Roeder, M.; Drexler, M.; Haybat, M.; Wappler, P.; Soltani, M.; Zimmermann, A.

Apllied sciences, 2076-3417, pp. von Seite – bis Seite: 4197, 2020

Kurzfassung einblenden

Thermoset materials offer a multitude of advantageous properties in terms of shrinkage and warpage as well as mechanical, thermal and chemical stability compared to thermoplastic materials. Thanks to these properties, thermosets are commonly used to encapsulate electronic components on a 2nd-level packaging prior to assembly by reflow soldering on printed circuits boards or other substrates. Based on the characteristics of thermosets to develop a distinct skin effect due to segregation during the molding process, the surface properties of injection molded thermoset components resemble optical characteristics. Within this study, molding parameters for thermoset components are analyzed in order to optimize the surface quality of injection molded thermoset components. Perspectively, in combination with a reflective coating by e.g., physical vapor deposition, such elements with micro-integrated reflective optical features can be used as optoelectronic components, which can be processed at medium-ranged temperatures up to 230 °C. The obtained results indicate the general feasibility since Ra values of 60 nm and below can be achieved. The main influencing parameters on surface quality were identified as the composition of filler materials and tool temperature.

Link to publication