| Jahr | Name |
|---|---|
| 2020 |
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection MoldingR. Kulkarni, M. Soltani, P. Wappler, T. Guenther, K.-P. Fritz, T. Grözinger, and A. Zimmermann MDPI Journal of Manufacturing and Materials Processing, 2020 |
| 2019 |
An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic PackagesR. Kulkarni, P. Wappler, M. Soltani, M. Haybat, T. Günther, T. Grözinger, and A. Zimmermann MDPI Journal of Manufacturing and Materials Processing, 2019, Link to publication |
| 2017 |
Feasibility of manufacturing packaged electronic systems by thermoset injection moldingR. Kulkarni, D. Hera, M. Soltani, T. Günther, T. Grözinger, and A. Zimmermann 11th Smart Systems Integration Conference, Cork, Ireland, 2017 |
| 2018 |
Experimental and computational study of array effects on LED thermal management on molded interconnect devices MIDM. Soltani, R. Kulkarni, Y. Liu, M. Barth, T. Groezinger, and A. Zimmermann 13th International Congress Molded Interconnect Devices (MID), Wuerzburg, Germany, 2018 |
| 2018 |
Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect DevicesJournal MDPI: Instruments, DOI: 10.3390/instruments2040028, Vol. 2, Nr. 4, p. 28, 2018 |
| 2018 |
Reliability study and thermal performance of LEDs on molded interconnect devices (MID) and PCBM. Soltani, M. Freyburger, R. Kulkarni, R. Mohr, T. Groezinger and A. Zimmermann The Multidisciplinary Open Access Journal IEEE Access, DOI: 10.1109/ACCESS.2018.2869017, Vol. 6, p. 51669–51679, 2018 |
| 2019 |
A Novel Approach for Lifetime Estimation of Electronic Components mounted on Plastic Substrates by Coupling Injection Molding Simulation to FE-AnalysisM. Soltani, R. Kulkarni, T. Groezinger and A. Zimmermann International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES), Wilmington, USA, 2019 |
| 2019 |
A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding SimulationM. Soltani, R. Kulkarni, T. Scheinost, T. Groezinger and A. Zimmermann The Multidisciplinary Open Access Journal IEEE Access, DOI: 10.1109/ACCESS.2019.2913786, Vol. 7, p. 56163–56173, 2019
|
| 2019 |
A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding SimulationM. Soltani, R. Kulkarni ,T. Scheinost, T. Groezinger, A. Zimmermann IEEE Access, DOI: 10.1109/ACCESS.2019.2913786, Bd. 7, pp. 56163–56173 |
| 2019 |
A Novel Approach for Lifetime Estimation of Electronic Components mounted on Plastic Substrates by Coupling Injection Molding Simulation to FE-AnalysisM. Soltani, R. Kulkarni ,T. Groezinger, A. Zimmermann International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES), 16.06.2019 - 20.06.2019, Wilmington, USA |
| 2019 |
Zuverlässigkeitsuntersuchungen und Lebensdauermodelle von LEDs auf räumlichen SchaltungsträgernM. Soltani Workshop Visions to Products MID and Beyond, 15.10.2019, Stuttgart, Deutschland |
| 2019 |
Void formation in solder joints under power cycling conditions and its effect on reliabilityJ. Mei, R. Haug, S. Hinderberger, T. Grözinger, A. Zimmermann Microelectronics Reliability, Volumes 100–101: 113350 Kurzfassung einblendenWhen electronic assemblies are experiencing high current loading conditions, thermo-mechanical mismatch induced from the local Joule heating of the component and electromigration (EM)-induced void formation can lead to the failure of the solder interconnect. Scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) are adopted to investigate the microstructural evolution of solder joints of shunt components subjected to current stressing. Voids and micro-cracks initiate at the corner of solder meniscus, where the maximal divergence of material flux density is located on the basis of finite element method (FEM) simulation. The EM-induced voids introduce higher accumulated plastic strain in the solder joints, which will result in reduction in the lifetime of the electronic assemblies. |
| 2019 |
An UHF Software Defined Reflectometer using Under-Sampling Down-Conversion in the ADCV. Kible, R. Nunes de Lima, K. Brito de Brito, A. Bülau, A. Zimmermann European Microwave Week 2019 (EUMW/EUMC), 29.09.2019 – 04.10.2019, präsentiert 2.10.2019, Paris, Frankreich Radio frequency reflectometry is widely used in non-destructive characterization of various materials and can also be applied to automatic impedance matching systems in telecommunication devices. Here, a novel, low cost, software defined approach for measuring the reflection coefficient without using mixers or power detectors is proposed, enabled by using under-sampling down-conversion with an analog-digital-converter. Minimizing the analog part of the system removes possible error sources and a modular design allows application in different fields as well as an implementation as an integrated circuit. Computer simulations as well as measurement results on a printed circuit board setup for a system frequency of 400 MHz are presented, permitting extrapolation to other ultra-high frequencies. |
| 2019 |
Field scale variability of plant-available nitrogen and its detectability by different soil sensing systems/ AgraSensE. Wallor, M. Bourouah, K.C. Kersebaum, R. Gebbers 12th European Conference on Precision Agriculture, 08. - 11.07.2019, Montpellier, Frankreich Agriculture contributes the strongest to the nitrogen (N) enrichment of ecosystems. It is therefore important to know the spatial distribution of factors influencing N losses or to know the distribution of soil nitrate itself. One resource-extensive method to capture nitrate variability is the use of sensors. The present study examines the within-field variability of soil mineral N resulting from three sampling strategies and compares outputs of an ion-selective electrode (ISE) and a colorimeter to the results of the Nmin-method. With regard to sampling, the differences in the measured soil states are more pronounced when grouped by soil texture classes. The sensory measured nitrate concentration normally exceeds that of the Nmin-method. Furthermore, type and quality of the relation between sensory and conventional nitrate results depend on the preparation of soil samples and their organic carbon content. |
| 2019 |
Self-Tunable Vibration Energy Harvester (Projekt AMELI 4.0: Schall- und MEMS-basiertes Elektroniksystem für Industrie 4.0)J. Esch, D. Hoffmann, D. Stojakov and Y. Manoli microTEC Südwest Clusterkonferenz 2019, 20.-21.03.2019, Freiburg / Deutschland |
| 2019 |
Lokale Energieversorgung auf rotierenden Wellen am Beispiel eines Condition Monitoring Systems für Schiffsgetriebe (Projekt CoMoGear: Condition Monitoring of Marine Gearboxes based on Wireless, Energy-Autonomous Sensor Nodes)J. Esch, D. Stojakov, D. Schillinger, D. Hoffmann und Y. Manoli VDC MeetUp – Vernetzte intelligente Sensorsysteme, 23.05.2019, St. Georgen / Deutschland |
| 2017 |
Simulationsgestützte ZuverlässigkeitsuntersuchungenT. Grözinger 2017 „MULTIFUNKTIONALER KUNSTSTOFF - 3D-TECHNOLOGIEN“, Virtual Dimension Center TZ St. Georgen, 23.05.17 Kurzfassung einblendenDie Absicherung der Zuverlässigkeit von Produkten beginnt bereits in der frühen Entwurfs- und Entwicklungsphase. Lernen Sie wesentliche Werkzeuge wie Simulation und Zuverlässigkeitsanalysen kennen. |
| 2012 |
Experimental Characterization and Finite Element Analysis of Thermo-Mechanical Stress in Flip-Chip- and Wirebond-Assemblies on Flexible and Injection Molded Thermoplastic SubstratesM. Schober, H. Kück, C. Goth, A. Reinhardt, J. Franke, S. Majcherek, A. Brose, B. Schmidt, 2012 Proceedings der 4. ESTC-Konferenz (Electronic System-Integration Technology Conference), Amsterdam, 17.-20.09.2012 |
| 2012 |
Numerische Zuverlässigkeitsanalyse von MID-BaugruppenM. Schober, H. Kück 2012 10. International Congress Molded Interconnect Devices, Fürth, 20.09.2012 |
| 2013 |
Simulationsgestützte ZuverlässigkeitsuntersuchungenT. Grözinger 2013 Workshop „Vom Granulat zum System - Technologien für kunststoffbasierte Mikrosysteme“, VIRTUAL DIMENSION CENTER, Technologiezentrum St. Georgen, 11.07.2013 |
Wissenschaftliche Publikationen "Messtechnik + Simulation"
