Jahr Name
2019

A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation

M. Soltani, R. Kulkarni ,T. Scheinost, T. Groezinger, A. Zimmermann

IEEE Access, DOI: 10.1109/ACCESS.2019.2913786, Bd. 7, pp. 56163–56173

2019

A Novel Approach for Lifetime Estimation of Electronic Components mounted on Plastic Substrates by Coupling Injection Molding Simulation to FE-Analysis

M. Soltani, R. Kulkarni ,T. Groezinger, A. Zimmermann

International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES), 16.06.2019 - 20.06.2019, Wilmington, USA

2019

Zuverlässigkeitsuntersuchungen und Lebensdauermodelle von LEDs auf räumlichen Schaltungsträgern

M. Soltani

Workshop Visions to Products MID and Beyond, 15.10.2019, Stuttgart, Deutschland

2019

Void formation in solder joints under power cycling conditions and its effect on reliability

J. Mei, R. Haug, S. Hinderberger, T. Grözinger, A. Zimmermann

Microelectronics Reliability, Volumes 100–101: 113350

Kurzfassung einblenden

When electronic assemblies are experiencing high current loading conditions, thermo-mechanical mismatch induced from the local Joule heating of the component and electromigration (EM)-induced void formation can lead to the failure of the solder interconnect. Scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) are adopted to investigate the microstructural evolution of solder joints of shunt components subjected to current stressing. Voids and micro-cracks initiate at the corner of solder meniscus, where the maximal divergence of material flux density is located on the basis of finite element method (FEM) simulation. The EM-induced voids introduce higher accumulated plastic strain in the solder joints, which will result in reduction in the lifetime of the electronic assemblies.


Link zum Paper

2019

An UHF Software Defined Reflectometer using Under-Sampling Down-Conversion in the ADC

V. Kible, R. Nunes de Lima, K. Brito de Brito, A. Bülau, A. Zimmermann

European Microwave Week 2019 (EUMW/EUMC), 29.09.2019 – 04.10.2019, präsentiert 2.10.2019, Paris, Frankreich
Gefördert von brasilianischen Institutionen: CNPq (Conselho Nacional de Desenvolvimento Científico e Tecnológico) und FAPESB (Fundação de Amparo à Pesquisa do Estado da Bahia).

Kurzfassung einblenden

Radio frequency reflectometry is widely used in non-destructive characterization of various materials and can also be applied to automatic impedance matching systems in telecommunication devices. Here, a novel, low cost, software defined approach for measuring the reflection coefficient without using mixers or power detectors is proposed, enabled by using under-sampling down-conversion with an analog-digital-converter. Minimizing the analog part of the system removes possible error sources and a modular design allows application in different fields as well as an implementation as an integrated circuit. Computer simulations as well as measurement results on a printed circuit board setup for a system frequency of 400 MHz are presented, permitting extrapolation to other ultra-high frequencies.


Link zum Paper

2019

Field scale variability of plant-available nitrogen and its detectability by different soil sensing systems/ AgraSens

E. Wallor, M. Bourouah, K.C. Kersebaum, R. Gebbers

12th European Conference on Precision Agriculture, 08. - 11.07.2019, Montpellier, Frankreich
DOI: 10.3920/978-90-8686-888-9_71

Kurzfassung einblenden

Agriculture contributes the strongest to the nitrogen (N) enrichment of ecosystems. It is therefore important to know the spatial distribution of factors influencing N losses or to know the distribution of soil nitrate itself. One resource-extensive method to capture nitrate variability is the use of sensors. The present study examines the within-field variability of soil mineral N resulting from three sampling strategies and compares outputs of an ion-selective electrode (ISE) and a colorimeter to the results of the Nmin-method. With regard to sampling, the differences in the measured soil states are more pronounced when grouped by soil texture classes. The sensory measured nitrate concentration normally exceeds that of the Nmin-method. Furthermore, type and quality of the relation between sensory and conventional nitrate results depend on the preparation of soil samples and their organic carbon content.


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2019

Self-Tunable Vibration Energy Harvester (Projekt AMELI 4.0: Schall- und MEMS-basiertes Elektroniksystem für Industrie 4.0)

J. Esch, D. Hoffmann, D. Stojakov and Y. Manoli

microTEC Südwest Clusterkonferenz 2019, 20.-21.03.2019, Freiburg / Deutschland

2019

Lokale Energieversorgung auf rotierenden Wellen am Beispiel eines Condition Monitoring Systems für Schiffsgetriebe (Projekt CoMoGear: Condition Monitoring of Marine Gearboxes based on Wireless, Energy-Autonomous Sensor Nodes)

J. Esch, D. Stojakov, D. Schillinger, D. Hoffmann und Y. Manoli

VDC MeetUp – Vernetzte intelligente Sensorsysteme, 23.05.2019, St. Georgen / Deutschland

2017

Simulationsgestützte Zuverlässigkeitsuntersuchungen

T. Grözinger

2017 „MULTIFUNKTIONALER KUNSTSTOFF - 3D-TECHNOLOGIEN“, Virtual Dimension Center TZ St. Georgen, 23.05.17

Kurzfassung einblenden

Die Absicherung der Zuverlässigkeit von Produkten beginnt bereits in der frühen Entwurfs- und Entwicklungsphase. Lernen Sie wesentliche Werkzeuge wie Simulation und Zuverlässigkeitsanalysen kennen.

2012

Experimental Characterization and Finite Element Analysis of Thermo-Mechanical Stress in Flip-Chip- and Wirebond-Assemblies on Flexible and Injection Molded Thermoplastic Substrates

M. Schober, H. Kück, C. Goth, A. Reinhardt, J. Franke, S. Majcherek, A. Brose, B. Schmidt,

2012 Proceedings der 4. ESTC-Konferenz (Electronic System-Integration Technology Conference), Amsterdam, 17.-20.09.2012

2012

Numerische Zuverlässigkeitsanalyse von MID-Baugruppen

M. Schober, H. Kück

2012 10. International Congress Molded Interconnect Devices, Fürth, 20.09.2012

2013

Simulationsgestützte Zuverlässigkeitsuntersuchungen

T. Grözinger

2013 Workshop „Vom Granulat zum System - Technologien für kunststoffbasierte Mikrosysteme“, VIRTUAL DIMENSION CENTER, Technologiezentrum St. Georgen, 11.07.2013