Jahr Name
2022

Intelligenter optischer Drehwinkelsensor (INOSENS)

J. Seybold

Abschlussbericht

2022

Digitaler Retrofit von Maschinen und Produktionsanlagen

Karl-Peter Fritz, Henning Strauß, Christoph Rathfelder, André Bülau, Daniel Gaida

ISSN: Vogel Fachuch 978-3-8343-3481-7


Link zum Paper

2021

Autonomer mikromechanischer Sterilisationszyklenzähler (AuSter)

D. Hoffmann

Schlussbericht AuSter IGF-Vorhaben 20710BG

2021

Entwurf einer CMOS-integrierten, rauscharmen Stromausleseschaltung mit niedriger Eingangskapazität für die medizinische Diagnostik via biologischer Nanoporen

M. Amayreh, S. Elsaegh, N. Butz, M. Kuderer, Y. Manoli

MikroSystemTechnik Kongress 2021, 08.11.2021 - 10.11.2021, Stuttgart-Ludwigsburg, Deutschland


Link zum Paper

2021

A Mechanism for Seamless Cryptographic Rekeying in Real-Time Communication Systems

H. Bühler, A. Walz, A. Sikora

2021 17th IEEE International Workshop on Factory Communication Systems (WFCS), 09.-11.06.2021, Linz, Austria

Kurzfassung einblenden

Cryptographic protection of messages requires frequent updates of the symmetric cipher key used for encryption and decryption, respectively. Protocols of legacy IT security, like TLS, SSH, or MACsec implement rekeying under the assumption that, first, application data exchange is allowed to stall occasionally and, second, dedicated control messages to orchestrate the process can be exchanged. In real-time automation applications, the first is generally prohibitive, while the second may induce problematic traffic patterns on the network. We present a novel seamless rekeying approach, which can be embedded into cyclic application data exchanges. Although, being agnostic to the underlying real-time communication system, we developed a demonstrator emulating the widespread industrial Ethernet system PROFINET IO and successfully use this rekeying mechanism.

 

Link zum Paper

2021

Delta-Kodierung zur Reduzierung der Datenrate in neuronalen Sonden mit In-Situ Delta-Sigma Analog-Digital-Wandler Front-End

D. Wendler, J. Koerber, D. De Dorigo, R. Willaredt, Y. Manoli

MikroSystemTechnik Kongress, 08.-10. November 2021, Ludwigsburg

2021

Vapor HF Etching Based Surface Micromachining Process for Fabricating a Micromechanical Sterilization Cycle Counter

R. Vora, I. Spies, D. Hoffmann, H. Trautner, C. Blattert, A. Dehé

MikroSystemTechnik Congress 2021, 8-10 Nov. 2021, Stuttgart-Ludwigsburg, Germany

Kurzfassung einblenden

It is mandatory for manufacturers of reusable medical devices to specify the maximum of allowed sterilization cycles. This work focuses on the fabrication of an autonomous sterilization cycle counter in MEMS technology. Surface microm-achining is applied utilizing vapor HF (vHF) etching and subsequent polymer anti-stiction coating as an efficient tech-nique to remove sacrificial buried oxide layers and to release micro structure without stiction. The vHF etching process has been optimized and reaches etch rates of 900 nm/min for the buried oxide with a uniformity of more than 95 % across a 100 mm wafer. Based on this process a compatible design with perforated structures is implemented. Finally, devices of the sterilization cycle counter are successfully tested by a simulated sterilization cycle temperature test.

 

Link to publication

2021

Optimization of a High-g Acceleration Sensor for Crash-test Application

A. Srivastava, J. Rockstroh, A. Dehé

MikroSystemTechnik Congress 2021, 8-10 Nov. 2021, Stuttgart-Ludwigsburg, Germany

Kurzfassung einblenden

Piezoresistive accelerometers are a popular and widely used method of acceleration sensing due to their simplicity in fabrication, packaging and inherent ruggedness. These devices usually have simpler electronics for example compared to capacitive sensors. There are products available without ASICs as well. [1] This work takes an existing high-g piezoresistive accelerometer as a reference sensor and works on optimizing this design. The work delves into different design and optimization techniques to deliver novel high-performance piezoresistive acceleration sensor prototypes. These techniques exploit the device physics and mechanics to point towards the new designs. The sensor is designed and optimized to have higher bandwidth. The adaptation of SOI wafers instead of currently used epitaxial wafers, results in smaller chip size, enabling more chips/wafer and reducing the sensor cost. Extra emphasis has been laid to maintain high sensitivity, for specified doping of the piezoresistors, while still not compromising much on the resonance frequency. Finite element analysis with ANSYS Workbench offers insights into the device performance and helps in the determination of some key sensor parameters for the new designs. It also helps to establish trends and this provides an idea for the successive models. After several iterations and incorporating different optimization techniques, new models are achieved.

 

Link to publication

2021

Development of a hybrid microsystem for acquisition of sterilization cycles

D. Hoffmann, H. Trautner, S. Spieth, S. Herrlich, K. Pagel, A. Dehé

MikroSystemTechnik Congress 2021, 8-10 Nov. 2021, Stuttgart-Ludwigsburg, Germany

Kurzfassung einblenden

In this paper we present a hybrid microsystem for acquisition and counting of sterilisation cycles. The device includes a micromechanical counter mechanism and a thermal actuator based on a shape memory alloy (SMA). The device is designed to count 100 sterilization cycles. The basic functionality is investigated on a hotplate using a thermal temperature profile with a peak temperature of 135 deg C. In this manner, counting of thermal cycles is demonstrated.

 

Link to publication

2021

A Non-Linear Lumped Model for the Electro-Mechanical Coupling in Capacitive MEMS Microphones

S. Anzinger, C. Bretthauer, D. Tumpold, A. Dehé

Journal of Microelectromechanical Systems 30 (3), 360-368, doi: 10.1109/JMEMS.2021.3065129

Kurzfassung einblenden

This work provides an analytical non-linear model for the capacitive transduction in MEMS transducers with perforated counter-electrodes, especially applicable to capacitive MEMS microphones. Starting from an electrostatic description of a perforated unit cell of the transducer, analytical formulations of the variable capacitance and electrostatic forces are derived, accounting for the deflection profile of a clamped circular plate. A lumped implementation into conventional circuit simulations tools is enabled via behavioral modeling based on hardware description languages, such as Verilog-A. Therefore, the analytical model is approximated via Taylor series expansions, allowing for a stable and non-linear behavioral implementation. The resulting model finally enables both a small- and large-signal analysis of capacitive MEMS microphones, precisely accounting for non-linearities in the capacitive transduction. This allows to simulate the harmonic distortion of the microphone's output signal and to account for electrostatic spring-softening in simulations of its bias voltage dependent sensitivity.

 

Link to publication

2021

Development of A Z-Axis Out of Plane MEMS Accelerometer

A. Basavanna, M. Dienger, J. Rockstroh, S. Keller, A. Dehé

2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS), 25-29 Jan. 2021, Gainesville, USA

Kurzfassung einblenden

MEMS are minute electro-mechanical systems that are able to sense small changes in the environment and are responsible for a large chunk of the sensor market. MEMS inertial sensors such as gyroscopes and accelerometers have helped in realizing new products across a multitude of fields. One of the next aspects of MEMS Inertial sensors is the Internet of Things [IOT] and Industry 4.0. Hence, the following work depicts a sensor element design for vibration detection in Out Of Plane [OOP] axis (z-axis) proposed for closed loop control considering a system bandwidth of 20 kHz. The current work highlights the concept of an "anti-phase" design type sensor element developed considering either top or bottom electrodes allowing for the possibility of closed loop control. The translational motion of the sensor element along with the larger mass elements provides higher performance and lower noise. The analysis indicates a sensor element with size 1mm*1mm showcasing a specific open loop sensor sensitivity per area of 1.12 nF/g/m 2 with resonance frequency of 10.5 kHz and can be considered as a viable alternative to see-saw design type.

 

Link to publication

2021

Classification of cow behaviour for sensor assisted alpine milk production

T. Peikenkamp, D. Plaia, T. Hehn, D. Gaida, M. Hoenen, A. Ule

72nd Annual Meeting of the European Federation of Animal Science (EAAP), p. 387, 30.08. - 03.09.2021, Davos, Schweiz

2021

SESAM sensor technology for milk producers

L. Dale, Z. Vassilev, J. Bieger, K. Droessler, F. J. Auer, M. Erhart, T. Hehn, T. Peikenkamp, M. Klopcic, A. Werner, M. Hoenen

72nd Annual Meeting of the European Federation of Animal Science (EAAP), p. 386, 30.08. - 03.09.2021, Davos, Schweiz

2021

Reaktives Fügen von temperaturempfindlichen Dehnungssensoren

A. Schumacher, V. Shah, S. Steckemetz, G. Dietrich, E. Pflug, T. Hehn, S. Knappmann, A. Dehé, A. Leson

Journal of Materials Engineering and Performance, Band 30, pp. 7796-7804


Link to publication

2021

Reaktives Fügen von temperaturempfindlichen Dehnungssensoren

E. Pflug, A. Schumacher, G. Dietrich, S. Steckemetz, T. Hehn, S. Knappmann, A. Dehé, A. Leson

27. Neues Dresdner vakuumtechnisches Kolloquium (NDVaK), 17. - 18. März 2021, Online

2021

Telemetrische Verformungsmessung mit einem CMOS-integrierten Sensorchip

T. Hehn, H. Rietsche

Sensor und Test 2021, 04. - 06. Mai 2021, Online

2021

Joystick mit mehrachsigem Miniaturkraftsensor

T. Hehn

Innovationstag des Bundesministeriums für Wirtschaft und Energie (BMWi), 17.06.2021, Online

2021

Aufbau und Charakterisierung eines CMOS-integrierten Sensorsystems zur Messung von Verformungen

A. Schumacher, V. Shah, S. Knappmann, T. Hehn, A. Dehé

Mikrosystemtechnik-Kongress 2021, 9. - 10. November 2021, Ludwigsburg

2021

Multi-Axis Micro Force Sensor Based on a CMOS Integrated Chip

B. Folkmer, T. Hehn, M. Köhler, A. Willmann, D. Landler-Gärtner, A. Dehé

Mikrosystemtechnik-Kongress 2021, 9. - 10. November 2021, Ludwigsburg

2021

Das Online –Tool „Finde Dein Smart Home“ als Beratungshilfe

B. Inthasane

Fachtagung  - 3. Smart Day, 10.11.2021, Haigerloch