To generate conductive structures on thermoplastic injection molding parts, the selective wet-chemical metalization process is extremely important for most MID technologies. The metal layer systems used here are basically similar to the systems used in printed circuit board technology, but with the MID technologies, the main focus is on the respective pre-treatment process prior to metal deposition.
A defined surface micro-roughness on the plastic surface is the key factor for generating firmly-bonded metallic layers on the plastic part. With semi-additive laser MID processes (LSA) and the 2C MID technology, the surface micro roughness of the plastic surface is generated through wet-chemical pre-treatment of the plastic component. For laser direct structuring in accordance with the LPKF-LDS® process, however, a laser process ensures the necessary surface micro-roughness.
In our metalization line, MID's can be coated with the typical outside-currentless layer system with copper, nickel, and gold. Monitoring of the outside currentless copper electrolytes in the LPKF-LDS® process occurs with the measuring system e-Cu:Check measuring system that we developed. Alternatively, other surface layers, such as chemical silver or chemical zinc are also possible. Currently we are working on a surface layer of chemically deposited palladium/gold that is particularly promising for medical technology applications. In addition, the system also offers a possibility for galvanic reinforcement of metal layers deposited without external power (outside currentless). This is advantageous if high current-carrying capacity or heat conductivity are required. In addition to the established processes, we can also offer process development for other layer systems and thus respond flexibly to your requirements.
Our systems have modular process tanks with a working volume of approximately 30 liters. Depending on size and geometry, the MID parts can be processed in frames or drums.