Using the Hahn-Schickard printing process, it is possible to print a variety of functional materials to different substrates. This makes it possible to integrate circuit path structures, multilayer systems, resistors or capacitors, for example. Processes for pre-treatment and post-treatment such as plasma processes or thermal and photonic sintering are also available.
Conductive polymers such as PEDOT: PSS or formulations with suitable metal nano-particles can be used for the production of printed circuit paths. Silver nano-particles are currently the most commonly used.
Rising raw material prices for silver are steadily driving the development of less expensive nano-particulate copper inks for the production of printed circuit paths. Other commercially available printable nano-particulate metal inks contain, for example, gold, platinum, palladium, nickel or aluminum. To create a circuit path from a printed metal ink, it must be sintered. The melting temperature of nano-particulate metals depends heavily on the particle size. This means that nano-particulate metal inks with the corresponding particle size can be sintered at temperatures below 200 ° C.
Printing an insulator layer on the first conductor level and a second conductor level on the layer stack of the first conductor level and insulator creates new options for multi-layer circuit path structures. This contributes to the unbundling and therefore to the saving of space in complex circuit path systems. The first conductor level can be created either with the inkjet, aerosol jet®, or also LPKF-LDS® technology. The second conductor level and the insulator layer can be printed using inkjet or aerosol jet® technology. With a comparable layer structure, it is also possible to create printed capacitors (another example of passive components).