Thermosets are particularly resistant plastics, which can no longer be thermally formed after curing – they are ideal for the housings of microsystems.
Thermosets are characterized by extremely high mechanical strength, chemical and thermoforming resistance, high dimensional stability, creep tendency, and low-flammability. Due to their minimal processing viscosity they can be processed with low cavity pressures and flow speeds so that encapsulation of filigree structures is possible. This means that electronic components or microsystem components can be robustly encapsulated via thermoset injection molding.
With thermoset injection molding, an epoxy molding compound in the form of free-flowing granulate is supplied to the plasticization unit, and preheated, plasticized, and homogenized to approx. 80 to 110 degrees in the thermoset cylinder. The curing process begins at injection into the hot 160 - 180 degree tool. After a heating time of approximately 20 to 60 seconds, depending on material and wall thickness, the component can be removed.
In the thermoset injection molding area we are currently working on industrial projects for automotive engineering and medical engineering companies. Moreover, we conduct thorough experiments for encapsulation of inserts with the objective of providing a robust and cost-effective encapsulation of electronics. We are also researching MID engineering processes in combination with thermosets.