Connecting micro-structured films

Grinding pattern of micro-thermally formed and thermally limited microchannel: the capping is performed up to the edge of the channel and shows no deformation of the channel

The connecting of multiple plastic layers with integrated channels is a key technology for the construction of fluidic, impermeable and functional lab-on-a-chip systems. In this regard, as a rule, a microstructured component is capped with a flat sealing film. Depending on the application requirement, different adhesive systems or thermally bonding ceiling films are available.   

Regardless of whether micro-thermally formed films, hot-stamped parts or injection molded parts are involved – chambers and the finest micro-channels must be reliably sealed without clogging micro channels in the process and without thermally stressing upstream reagents and without impairing the subsequent biological confirmation (assay).

Depending on the application and requirement, different capping technologies are suitable; we would be pleased to advise you in this regard. Our approaches are pressure-sensitive adhesive films or thermal diffusion bonds.  Pressure-sensitive adhesive films only release a micro-encapsulated adhesive through pressure. This means that the adhesive can be selectively triggered on the contact surface, while the adhesive in the channels remains passive due to the encapsulation. Thermally bonded films have a higher bonding strength even under thermal load. Special co-extruded films permit reliable sealing without deforming the micro channels.

For bonding, we use equipment with plate sealing or roll lamination. Plate sealing is used in the hot-stamping of the HEX01 or Wickert machine. The precise regulation of force and the vacuum evacuating capacity of the systems offer flexible, easily-adaptable process management. Alternatively, a roll laminator with a rubberized, temperature-control roller is available.


Dr. Rouven Streller
Phone: +49 761 203-73205