Wire bonding is the most important technique for electrical contacting of microchips with their environment. Whether it is within an SMD package or directly on the printed circuit board (chip-on-board), fine wires connect the contact surfaces of the chip to the contacts of the circuit carrier. Whether using fast ball-wedge wire bonding with gold wire or robust wedge-wedge wire bonding with aluminum wire, the requirements determine the application. Automated systems ensure high quality and productivity. Where required, a sealing compound (Globtop) made of epoxy or silicone gel, for example, ensures the protection of sensitive connections.