Wire bonding

Chip contacting trough wire bonding

Wire bonding is the most important technique for electrical contacting of microchips with their environment. Whether it is within an SMD package or directly on the printed circuit board (chip-on-board), fine wires connect the contact surfaces of the chip to the contacts of the circuit carrier. Whether using fast ball-wedge wire bonding with gold wire or robust wedge-wedge wire bonding with aluminum wire, the requirements determine the application. Automated systems ensure high quality and productivity. Where required, a sealing compound (Globtop) made of epoxy or silicone gel, for example, ensures the protection of sensitive connections.

Contact

Helmut Schottmann
Hahn-Schickard,
Villingen-Schwenningen
Helmut.Schottmann@Hahn-Schickard.de
Directions

Maximilian Barth
Hahn-Schickard,
Stuttgart
Phone: +49 711 685-83828
Maximilian.Barth@Hahn-Schickard.de
Directions