Chip assembly

Handling and assembly of microchips

Flip-chip on MID

Microchips can be mounted and connected directly onto printed circuit boards or 3D-MIDs by using flip-chip and assembly techniques. Handling requires maximum precision and cleanliness.

Whether sensor chips, ASICS, or laser diodes, non-housed microchips must be assembled directly on the system carrier to achieve a high integration density and miniaturization. Pickup of the chips from the wafer, exact referencing, and micrometer precision positioning take place under stringent requirements in terms of cleanliness in the clean room. Automatic chip assemblers ensure a very high level of reproducibility and productivity. In preparation for a subsequent wire-bonding step, the chips can be glued to the substrate with the connections pointing upward. The assembly space can be further minimized by using flip-chip technology.

Contact


Maximilian Barth
Hahn-Schickard,
Stuttgart
Phone: +49 711 685-83828
Maximilian.Barth@Hahn-Schickard.de
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