3D circuit paths on thermoset

Selected metalization of thermosets extends the material portfolio for 3D circuit carriers

Due to their high mechanical, thermal, and chemical robustness, thermosets components are increasingly used in the areas of automotive engineering and medical technology. Encapsulation of electronic modules or sensor components with thermosets for protection against mechanical stresses and environmental influences has been a standardized process for years.

Hahn-Schickard is working on an innovative laser-based process that allows selective metalization of thermosets which is similar to the versatile LPKF-LDS® process. However, materials with special additives are not required for the innovative process. The thermoset components are formed via conventional injection molding or transfer molding.


Dr. rer. nat. Wolfgang Eberhardt
Phone: +49 711 685-83717