The progressive FBM simulation methodology is used with the program ANSYS® to configure sensors, electronic components and plastic parts under temperature cycling, high temperature load, and vibration load. This makes it possible to quickly and cost-effectively evaluate the effects of designs, part and material selection, as well as assembly processes, on reliability even during the design phase.
We use the DIGIMAT and Surface Evolver programs as aids for even more precise modeling. With DIGIMAT, orientation of fillers directly from the injection molding simulation of the part can be used to take into account the anisotropic material character of reinforced or filled polymers. The molding of AVT connection materials can be calculated via Surface Evolver and used in a subsequent analysis with ANSYS.
We recalculate, analyze, and simulate for:
- Component load under thermo-mechanical stress
- Structure mechanics and vibration of electronic and plastic-based components
- Coupled simulation (multiphysics) of electrical-thermal processes in electronic components
- Thermal transfer in electronic components
- Parameter-assisted sensitivity analysis and design optimization