System-in-foil: Film-based microsystems with integrated ultra-thin components
Solutions for flexible, customer-specific solutions
System-in-foil enables integration of ultra-thin chips, sensors, coils, antennas, etc. in thin-walled structures and curved installation spaces, for example for Industry 4.0 cyber-physical systems (CPS), intelligent lightweight structures, near-body sensors for medical technology, and smart wearables.
At Hahn-Schickard we use different technologies for the construction of system-in-foil. In this regard our technology development focuses on structuring of film substrates, assembly and contacting of ultra-thin components, such as ultra-thin chips, and the composition of multi-layer systems. In addition, reliability under relevant load cases plays a crucial role. The combination of different technologies permits new degrees of freedom and new approaches for development in seeking the best-possible solutions for flexible, customer-specific solutions.
Technologies for system-in-foil
We use conformal coating for selective application of homogeneous photoresist layers. Alternatively, a dry resist film can be laminated. Structuring occurs with a maskless direct exposure unit. This enables an extremely flexible layout design and the possibility to react flexibly to substrate-related warping. PVD technology and galvanic metal deposition are used to build up the application-specific metal layers. Note that digital print technologies can be also be used in supplementation for this purpose.
Vacuum laminating and laser technologies are used for multilayer flexible systems. Ultra-thin chips are constructed with custom-manufactured placement tools on automated microassembly equipment.