Complex additive multi-material manufacturing of electronic circuits in free-form components (KompAS)

The BMBF-funded project aims to develop an innovative hybrid additive manufacturing platform for freeform 3D electronic circuits.

By integrating multiple printing technologies, including Fused Filament Fabrication (FFF), high-precision inkjet printing, molten metal deposition (StarJet technology), and in-line direct soldering of electronic components, the KompAS project enables customized, high-performance electronic structures with improved efficiency and sustainability.
 
This hybrid 3D printing platform improves the affordability and accessibility of electronics manufacturing for small and medium-sized companies, for example for demonstrator and small series production. Resource-efficient additive manufacturing eliminates the need for chemicals, solvents, water and wastewater in PCB production. The sustainable solution also opens up geometric design freedom. Complex and customized shapes and designs are attractive for various components, such as glucose test strips, solar cells, electronic prostheses, wearables and batteries.

The Hahn-Schickard plays a crucial role in developing the StarJet printhead for high performance conductive metal trace printing from and direct interconnecting of the electronic components during the hybrid additive manufacturing of 3D electronic circuits. Thanks to the non-contact printing of molten metal via StarJet technology, there is no need for post-treatment like drying of solvent and sintering, which highly simplify the manufacturing process, increase the manufacturing freedom, and is environmental friendly. More specifically, Hahn-Schickard will further enhance the StarJet printhead so that it can print new metal alloys (e.g. ZAMAK, melting point 380 – 400 °C) which has higher thermal stability and electrical conductivity for high performance electronic applications.