Aim of the project is the development of a process for generation of 3D conductor paths on thermoset 3D packages and for direct electric connection of encapsulated electronic components.
First results of a laser-based process in combination with electroless plating show the high potential for generation of conductor paths on injection molded or transfer molded thermoset substrates. For optimum performance and process reliability of the new process cause-effect relationships will be investigated, especially the impact of filler materials in the thermoset compounds on the selective plating process. Based on these results, the realization of 3D packages of electronical components (e.g. chip packages) without interconnection board will be investigated. By selective electroless plating of the 3D package the package surface will be used for assembly of further components and for direct electric connection of encapsulated electronic components. The electrical connection from the package surface to the encapsulated electronic component is enabled by laser drilled and electroless plated vias. These vias are made in the same process as the conductor paths on the package surface.back to overview
|Funding Number:||19758 N|
|Duration:||01.01.2018 to 31.12.2019|
|Cooperation Partner:||Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS), Friedrich-Alexander-Universität Erlangen-Nürnberg|