Low-stress assembly of micro systems for high temperature applications using TLP-bonding (Sensor-TLP)

Transient liquid phase (TLP) bonding is a novel attachment method for high temperature applications. In cooperation with the University of Freiburg, TLP-bonding is investigated with emphasis on low-stress assembly and hermetic sealing for micro system applications on chip-level as well as on wafer-level.

Main activities are:

  • Development of multilayer-systems for TLP-bonding
  • Developing the process technology for TLP-bonding
  • Characterization of bond strength and quality
  • Developing of wafer level processes for TLP-bonding
  • Simulation and modeling
  • Verification by means of working prototypes
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Sponsor: Federal Ministry for Economic Affairs and Energy
Promoter: IGF
Funding Number: 18476 N / 2
Duration: 01.07.2016 to 31.12.2018
Cooperation Partner: Hahn-Schickard Villingen-Schwenningen; Universität Freiburg, IMTEK, Professur für Aufbau- und Verbindungstechnik
Maturity Level: Research > Research pattern


Dr.-Ing. Axel Schumacher
Phone: +49 7721 943-237