Transient liquid phase (TLP) bonding is a novel attachment method for high temperature applications. In cooperation with the University of Freiburg, TLP-bonding is investigated with emphasis on low-stress assembly and hermetic sealing for micro system applications on chip-level as well as on wafer-level.
Main activities are:
|Sponsor:||Federal Ministry for Economic Affairs and Energy|
|Funding Number:||18476 N / 2|
|Duration:||01.07.2016 to 31.12.2018|
|Cooperation Partner:||Hahn-Schickard Villingen-Schwenningen; Universität Freiburg, IMTEK, Professur für Aufbau- und Verbindungstechnik|
|Maturity Level:||Research > Research pattern|