Pilot Factory for 3D High Precision MID Assemblies (3D-HiPMAS)

3D-HiPMAS targets on improving MID technology and developing of a pilot line for manufacturing of 3D high precision MID Assemblies for different branches. 3D-HiPMAS addresses the following topics:

  • Improved LDS thermoplastics (fine pitch, CTE, thermal conductivity) and injection molding
  • Laser structuring and electroless metal plating processes Cu/Ag and Cu/Pd/Au for 70 µm pitch in 2D and 150 µm pitch in 3D
  • 3D assembly processes (dispensing, SMD- and chip assembly, laser soldering)
  • Machinery: Fine focus laser system (20 µm), 3D assembly OurPlant, X-ray inspection
  • Technology verification on 4 demonstrators from different branches
  1. Medical technology
  2. Energy
  3. Automotive
  4. Information and communication
  • Exploitation of other branches e.g. toys
  • Pilot line for 3D-HiPMAS technology at Hahn-Schickard Stuttgart
back to overview


Funding Number: 314293
Duration: 01.10.2012 to 30.09.2015
Cooperation Partner: LPKF Laser & Electronic AG, Photonic Science Ltd, Häcker Automation GmbH, Radiall, Pragma Industries SAS, Sonova AG, Association Pole Europeen de Plasturgie (PEP), Commissariat a l´energie atomique et aux energies alternatives (CEA), Plastipolis, Ensinger GmbH, Rayce SARL
Maturity Level: Research > Research pattern > Prototype


Dr. rer. nat. Wolfgang Eberhardt
Phone: +49 711 685-83717