Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.

Jahr	Name
2023	TinyProp - Adaptive Sparse Backpropagation for Efficient TinyML On-device Learning M. Rüb, D. Maier, A. Sikora, D. Mueller-Gritschneder 2023 International Conference on Artificial Intelligence and Power Engineering (AIPE 2023), 03.-05.03.2023, Tokyo, Japan
2023	Transfer-Learning-Based Estimation of the Remaining Useful Life of Heterogeneous Bearing Types Using Low-Frequency Accelerometers S. Schwendemann, A. Sikora J. Imaging 2023, 9(2), 34 show abstract Link to paper
2023	Blockchain Interoperability: The State of Heterogenous Block-chain-to-Blockchain Communication S.D. Kotey, E.T. Tchao, A.-R. Ahmed, A.S. Agbemenu, H. Nunoo-Mensah, A. Sikora, D. Welte, E. Keelson IET Communications show abstract Link to paper
2023	Security Enhanced Hybrid Electronic System in Foil for Temperature Sensing A. Scholz, T. Wolfer, M. Friedrich, B. Albrecht, S. Sauva, T. Kister, M. Lay, S. Abdolinezhad, W. Hadrich, S. Alam, G. Dost, C. Harendt, A. Sikora, T. Kraus, J. Aghassi-Hagmann 5th IEEE International Flexible Electronics Technology Conference (IFETC) 2023, 13.-16.08.2023
2023	Automated Physical TestBeds (APTB 2.0): Enabling Reliable and Efficient Testing of Wireless Communication Networks for IoT and Industry 4.0 A. Sikora, F. Sowieja, J. Sebastian E, M. Schappacher, W. Hadrich IEEE INDIN 2023, 17.-20.07.2023
2023	Methodology and Implementation for Monitoring Precise Time Synchronisation in TSN K. Naik, D. Welte, S. Oechsle, F. Frick, A. Lechler, M. Schappacher, A. Sikora IEEE INDIN 2023, 17.-20.07.2023
2023	Trust Management System for Hybrid Industrial Blockchains F. Stodt, C. Reich, A. Sikora, D. Welte IEEE INDIN 2023, 17.-20.07.2023
2023	EREMI: An Innovative Interdisciplinary Approach for Higher Education in Resource Efficient Manufacturing Environments A. Sikora, T. Titova-Kosturkova, G. Janevska, M. Kostov, S. Halunga, G. Suciu, G. Georgiev Sustainability, 2023, DOI: 10.20944/preprints202306.1045.v1
2023	Certificate-Based Primary Authentication for 5G Networks A. Shukla, F. Sowieja, J. Sebastian, A. Sikora 12th IEEE International Conference on Intelligent Data Acquisition and Advanced Computing Systems: Technology and Applications, 07.-09.09.2023, Dortmund, Germany
2023	Performance Evaluation of TLS Session Establishments on an ARM Cortex-M4 Platform J. Göppert, A. Chomel, J. Sebastian, A. Sikora 12th IEEE International Conference on Intelligent Data Acquisition and Advanced Computing Systems: Technology and Applications, 07.-09.09.2023, Dortmund, German
2023	Output Positioning to Derive Maximum Entropy from Physical Unclonable Function S. Abdolinezhad, L. Zimmermann, A. Sikora IEEE Transactions on Information Forensics and Security, 28.09.2023, doi: 10.1109/TIFS.2023.3320608
2023	Detailed Study of Different Degradation Stages of Bearings in a Practical Reference Dataset S. Schwendemann, A. Rausch, A. Sikora IEEE ETFA 2023 - IEEE International Conference on Emerging Technologies and Factory Automation, 12.-15.09.2023, Sinaia, Romania show abstract Link to paper
2023	A NETCONF-Based Solution for Credential Management in Time-Sensitive Networks A. Shubbar, A. Walz, J. Göppert, A. Sikora IEEE ETFA 2023 - IEEE International Conference on Emerging Technologies and Factory Automation, 12.-15.09.2023, Sinaia, Romania show abstract Link to paper
2023	A Hybrid Predictive Maintenance Solution for Bearings for Fault Classification and Remaining Useful Life Estimation Using Low-Cost Sensor Hardware S. Schwendemann, A. Rausch, A. Sikora 5th International Conference on Industry 4.0 and Smart Manufacturing (ISM 2023), 22.-24.11.2023, Lisbon, Portugal show abstract Link to paper
2023	TinyProp - Adaptive Sparse Backpropagation for Efficient TinyML On-device Learning M. Rüb, D. Maier, D. Mueller-Gritschneder, A. Sikora 2023 International Conference on Artificial Intelligence and Power Engineering (AIPE 2023), Tokyo, ArXiv abs/2308.09201
2023	Piezoresistive-Based Physical Unclonable Function S. Abdolinezhad, V. Stavrov, L. Zimmermann, A. Sikora IEEE Sensors Journal 2024, doi: 10.1109/JSEN.2024.3367735
2023	Security Aspects of Smart Meter Infrastructures I. Rigoev, A. Sikora Smart Meters, Artificial Intelligence to Support Proactive Management of Energy Consumption, Springer Lecture Notes in Energy, pp. 77-154, 02.04.2023. show abstract Link to publication
2024	Optimierte reaktive Bondtechnologie auf der Basis neuartiger Zirkonium Systeme für den Einsatz in der Mikrosystemtechnik (Join-ZiSi) A. Schumacher, G. Buschbeck, I. Käpplinger Abschlussbericht zum IGF-Vorhaben Nr. 21347 BG
2023	Micro-Electrode-Cavity-Array (MECA) on a CMOS Chip M. Amayreh, S. Elsaegh, M. Kuderer, C. Blattert, H. Rietsche, O. Amft Black Forest Nanopore Meeting 2023, 06.-09.11.2023, Freiburg, Deutschland show abstract This work represents a CMOS-Based nanoporesensing platform for high resolution readout of nanoporeevents. CMOS integration reduces the overall capacitance of the readout which reduces the overall noise and thus allows detecting of fast and/or small nanoporeevents. The current readout circuit is configurable for different current ranges and bandwidths and optimized for noise suppression. The circuit is divided into four amplifier stages. Noise reduction techniques achieve a total integrated noise of only 18 pARMSin a bandwidth of 1 MHz. The ASIC was implemented in a 350 nm standard CMOS technology. The ASIC consists of five channels. Four of them are used as a MECA. Link to paper
2024	Hybrid 3D Printing of Molten Metal Microdroplets and Polymers for Prototyping of Printed Circuit Boards Featuring Interdigitated 3D Capacitors Z. Khan, D. Gururajan, P. Koltay, S. Kartmann, R. Zengerle, Z. Shu EEJ TRANSACTIONS ON ELECTRICAL AND ELECTRONIC ENGINEERING, IEEJ Trans 2024, doi:10.1002/tee.24035

Are you looking for something?

Scientific publications

At Hahn-Schickard, research also means publishing findings in scientific publications.

TinyProp - Adaptive Sparse Backpropagation for Efficient TinyML On-device Learning

Transfer-Learning-Based Estimation of the Remaining Useful Life of Heterogeneous Bearing Types Using Low-Frequency Accelerometers

Blockchain Interoperability: The State of Heterogenous Block-chain-to-Blockchain Communication

Security Enhanced Hybrid Electronic System in Foil for Temperature Sensing

Automated Physical TestBeds (APTB 2.0): Enabling Reliable and Efficient Testing of Wireless Communication Networks for IoT and Industry 4.0

Methodology and Implementation for Monitoring Precise Time Synchronisation in TSN

Trust Management System for Hybrid Industrial Blockchains

EREMI: An Innovative Interdisciplinary Approach for Higher Education in Resource Efficient Manufacturing Environments

Certificate-Based Primary Authentication for 5G Networks

Performance Evaluation of TLS Session Establishments on an ARM Cortex-M4 Platform

Output Positioning to Derive Maximum Entropy from Physical Unclonable Function

Detailed Study of Different Degradation Stages of Bearings in a Practical Reference Dataset

A NETCONF-Based Solution for Credential Management in Time-Sensitive Networks

A Hybrid Predictive Maintenance Solution for Bearings for Fault Classification and Remaining Useful Life Estimation Using Low-Cost Sensor Hardware

TinyProp - Adaptive Sparse Backpropagation for Efficient TinyML On-device Learning

Piezoresistive-Based Physical Unclonable Function

Security Aspects of Smart Meter Infrastructures

Optimierte reaktive Bondtechnologie auf der Basis neuartiger Zirkonium Systeme für den Einsatz in der Mikrosystemtechnik (Join-ZiSi)

Micro-Electrode-Cavity-Array (MECA) on a CMOS Chip

Hybrid 3D Printing of Molten Metal Microdroplets and Polymers for Prototyping of Printed Circuit Boards Featuring Interdigitated 3D Capacitors