Jahr Name
2024

Digitalisierungstechnologien testen mit dem European Digital Innovation Hub Südwest

S. Spieth

To Connect – Smart Textiles & Mikrosystemtechnik, 01.10.2024, Villingen-Schwenningen / Deutschland
2024

EDIH Südwest – Beratungs- und Technologieangebote zur digitalen Transformation

S. Spieth

Smart Circuit: Regionales Treffen zur Einbeziehung von Interessengruppen in das Ökosystem “Town Hall”, 13.03.2024, Freiburg / Deutschland
2024

Manufacturing process for 10 nm SiNx membranes

A. Leibold, C. Blattert, S. Gutsch, A. Dehé

Innovative Retreat 2024 (nanodiagBW), 30.09.-02.10.2024, 78355 Hohenfels/ Deutschland

show abstract

The production of 10 nm thin silicon nitride (SiNx) membranes for solid-state nanopore sensors is a challenge, as numerous factors have to be taken into account. Instead of etching thicker membranes, research is focussing on the direct deposition of thin SiNx films using a modified LPCVD process at lower temperature. A SiO₂ underlayer reduces parasitic capacitance and compensates for stresses. KOH wet etching is used for membrane structuring, whereby protection is provided by a layer combination of PECVD-SiO₂ and LPCVD-SiNx.

Technical poster
2024

Fortschrittliche Glas-Interposer mit Carbon-Kupfer-Verbundmetallisierung

H. Scheithauer

Schlussbericht vom 30.10.2024 zu IGF-Vorhaben Nr. 337 EBG

show abstract

Schlussbericht "Fortschrittliche Glas-Interposer mit Carbon-Kupfer-Verbundmetallisierung" zu IGF-Vorhaben Nr. 337 EBG
2020

Hybrid Evaporation/Spray-Coating Process for a Simplified and Controllable Production of Perovskite Solar Cells

L. Cojocaru, K. Wienands, U. Erdil, P. Schulze, L. Mundt, A. Bett, M. Breitwieser, F. Lombeck, M. Prescher, L. Kirste, S. Vierrath, J. Goldschmidt

IEEE Journal of Photovoltaics, 10 (1), 276-286, doi: 10.1109/JPHOTOV.2019.2949763
2024

Optimierte reaktive Bondtechnologie auf der Basis neuartiger Zirkonium Systeme für den Einsatz in der Mikrosystemtechnik (Join-ZiSi)

A. Schumacher, G. Buschbeck, I. Käpplinger

Abschlussbericht zum IGF-Vorhaben Nr. 21347 BG
2023

Micro-Electrode-Cavity-Array (MECA) on a CMOS Chip

M. Amayreh, S. Elsaegh, M. Kuderer, C. Blattert, H. Rietsche, O. Amft

Black Forest Nanopore Meeting 2023, 06.-09.11.2023, Freiburg, Deutschland

show abstract
  • This work represents a CMOS-Based nanoporesensing platform for high resolution readout of nanoporeevents.
  • CMOS integration reduces the overall capacitance of the readout which reduces the overall noise and thus allows detecting of fast and/or small nanoporeevents.
  • The current readout circuit is configurable for different current ranges and bandwidths and optimized for noise suppression. The circuit is divided into four amplifier stages.
  • Noise reduction techniques achieve a total integrated noise of only 18 pARMSin a bandwidth of 1 MHz.
  • The ASIC was implemented in a 350 nm standard CMOS technology.
  • The ASIC consists of five channels. Four of them are used as a MECA.

 

Link to paper
2023

Reactive bonding of an integrated CMOS strain sensor to steel by using hard and soft solders

A. Schumacher, P. Meyer, G. Buschbeck, E. Pflug, J. Böttcher, S. Knappmann, T. Hehn, A. Dehé

MikroSystemTechnik Kongress 2023, 23.-25.10.2023, Dresden, Deutschland
ISBN: 978-3-8007-6203-3 (CD-ROM), 978-3-8007-6204-0 (E-Book), VDE Verlag GmbH
2023

Optimierte reaktive Bondtechnologie auf der Basis neuartiger Zirkonium Systeme für den Einsatz in der Mikrosystemtechnik (Join ZiSi)

A. Schumacher, G. Buschbeck, J. Böttcher, A. Grün, I. Käpplinger, S. Knappmann, P. Meyer, E. Pflug, A. Dehé

DVS Congress 2023, 11.-14.09.2023, Essen, Deutschland
DVS-Berichte Band 389, ISBN: 978-3-96144-230-0 (Print), 978-3-96144-231-7 (E-Book), DVS Media GmbH, Düsseldorf
2023

Reactive joining with braze: Novel zirconium based systems

E. Pflug, G. Buschbeck, A. Schumacher, J. Böttcher, S. Knappmann, P. Meyer, A. Dehé, O. Zimmer, V. Weihnacht

V-Messe, 18.-21.09.2023, Dresden, Deutschland

show abstract

Link to paper
2023

„EDIH Südwest“ – Beratungs- und Technologieangebote zur digitalen Transformation

S. Spieth

14. InnovationForum Smarte Technologien & Systeme, 15. Juni 2023, Donaueschingen
2023

„EDIH Südwest“ – Beratungs- und Technologieangebote zur digitalen Transformation von Unternehmen und Verwaltung

S. Spieth

microTEC Südwest Clusterkonferenz 2023, 15.-16. Mai 2023, Freiburg
2022

Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics

Peter Wappler, Tim Horter, Romit Kulkarni, Thomas Guenther, Karl-Peter Fritz & André Zimmermann

International Journal of Advanced Manufacturing Technology
2022

European Digital Innovation Hubs & their activities for SMEs

Rainer Günzler

Smart Systems Integration 2022, 26. – 28. April, Grenoble, Frankreich
2022

Effective MEMS Manufacturing Using Vapor HF Etch Processing Illustrated by Means of a Sterilization Cycle Counter

N. Baum, R. Vora, G. Endress, I. Spies, D. Hoffmann, H. Trautner, C. Blattert, A. Dehé, D. Anderson, T. O‘Hara

9. GMM Fachtagung Mikro-Nano-Integration, 21. – 22. November 2022, Aachen

show abstract

In the aftermath of COVID-19 and with an increased awareness of health issues, the use of precisely targeted technological
methodologies for the solution of specific healthcare problems is becoming increasing important in medical applications. The use of MEMS technology for the development of an efficient sterilisation cycle counter by Hahn-Schickard is a simple but very effective example of such an application. Surface micromachining is applied utilizing vapor HF (vHF) etching and subsequent polymer anti-stiction coating as an efficient technique to remove sacrificial buried oxide layers and to release micro structure without stiction. The vHF etching process has been optimized and reaches etch rates of 900 nm/min for the buried oxide with a uniformity of more than 95 % across a 100 mm wafer.

 

Link to publication
2022

Modellbasiertes reaktives Fügen

A. Belguanche, A. Schumacher, N. Desch, A. Benachour, J. Böttcher, G. Dietrich, E. Pflug, I. Spies, P. Meyer, B. Folkmer, S. Knappmann, P. Farber, J. Gräbel, M. Lake, A. Dehé

9. GMM-Workshop Mikro-Nano-Integration, 21. – 22. November, Aachen, Deutschland
2022

Modellierung und Simulation des reaktiven Fügeprozesses

A. Schumacher, B. Folkmer, S. Knappmann, A. Dehé, A. Belguanche, A. Benachour, P. Farber, N. Desch, M. Lake, E. Pflug, J. Böttcher, G. Dietrich

TechnologyMountains InnovationForum Smarte Technologien & Systeme, 31. März, Donaueschingen, Deutschland
2022

Novel Fabrication Technology for Thermoelectric Infrared Sensors Using Surface Micromachining

P. Raimann, S. Billat, I. Spies, J. Dietrich, D. Hoffmann, S. Keller, A. Dehé

Smart Systems Integration, 27.-28. April 2022, Grenoble, Frankreich

show abstract

In this paper a novel fabrication technology for thermoelectric infrared sensors is presented. For the first time, the thermal insulation of the absorber structure is achieved by self-assembling multilayer thermocouples. After removal of a sacrificial oxide layer by vapor hydrogen fluoride (vHF) etching, the thermocouples lift off due to residual stress gradients. This provides the necessary distance between the absorber and the substrate. Compared to state-of-the-art sensors, this implementation does not require extensive bulk processing such as grinding and cavity etching to achieve a thermally isolated absorber structure. The deflection of the realized structures has shown high agreement with an analytical model which is also presented in this paper.

 

Link to paper
Link to publication
2022

Microthermoforming - enhancing Blister technology

D. Kainz

12th European Thermoforming Conference 2022, 31st March - 1st April 2022, Vienna, Austria
2021

Reaktives Fügen von temperaturempfindlichen Dehnungssensoren

A. Schumacher, V. Shah, S. Steckemetz, G. Dietrich, E. Pflug, T. Hehn, S. Knappmann, A. Dehé, A. Leson

Journal of Materials Engineering and Performance, Band 30, pp. 7796-7804


Link to publication