Jahr | Name |
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2024 |
Optimierte reaktive Bondtechnologie auf der Basis neuartiger Zirkonium Systeme für den Einsatz in der Mikrosystemtechnik (Join-ZiSi)A. Schumacher, G. Buschbeck, I. Käpplinger |
2023 |
Micro-Electrode-Cavity-Array (MECA) on a CMOS ChipM. Amayreh, S. Elsaegh, M. Kuderer, C. Blattert, H. Rietsche, O. Amft Black Forest Nanopore Meeting 2023, 06.-09.11.2023, Freiburg, Deutschland show abstract
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2023 |
Reactive bonding of an integrated CMOS strain sensor to steel by using hard and soft soldersA. Schumacher, P. Meyer, G. Buschbeck, E. Pflug, J. Böttcher, S. Knappmann, T. Hehn, A. Dehé MikroSystemTechnik Kongress 2023, 23.-25.10.2023, Dresden, Deutschland |
2023 |
Optimierte reaktive Bondtechnologie auf der Basis neuartiger Zirkonium Systeme für den Einsatz in der Mikrosystemtechnik (Join ZiSi)A. Schumacher, G. Buschbeck, J. Böttcher, A. Grün, I. Käpplinger, S. Knappmann, P. Meyer, E. Pflug, A. Dehé DVS Congress 2023, 11.-14.09.2023, Essen, Deutschland |
2023 |
Reactive joining with braze: Novel zirconium based systemsE. Pflug, G. Buschbeck, A. Schumacher, J. Böttcher, S. Knappmann, P. Meyer, A. Dehé, O. Zimmer, V. Weihnacht V-Messe, 18.-21.09.2023, Dresden, Deutschland show abstract |
2023 |
„EDIH Südwest“ – Beratungs- und Technologieangebote zur digitalen TransformationS. Spieth 14. InnovationForum Smarte Technologien & Systeme, 15. Juni 2023, Donaueschingen |
2023 |
„EDIH Südwest“ – Beratungs- und Technologieangebote zur digitalen Transformation von Unternehmen und VerwaltungS. Spieth microTEC Südwest Clusterkonferenz 2023, 15.-16. Mai 2023, Freiburg |
2022 |
Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplasticsPeter Wappler, Tim Horter, Romit Kulkarni, Thomas Guenther, Karl-Peter Fritz & André Zimmermann |
2022 |
European Digital Innovation Hubs & their activities for SMEsRainer Günzler Smart Systems Integration 2022, 26. – 28. April, Grenoble, Frankreich |
2022 |
Effective MEMS Manufacturing Using Vapor HF Etch Processing Illustrated by Means of a Sterilization Cycle CounterN. Baum, R. Vora, G. Endress, I. Spies, D. Hoffmann, H. Trautner, C. Blattert, A. Dehé, D. Anderson, T. O‘Hara 9. GMM Fachtagung Mikro-Nano-Integration, 21. – 22. November 2022, Aachen show abstractIn the aftermath of COVID-19 and with an increased awareness of health issues, the use of precisely targeted technological
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2022 |
Modellbasiertes reaktives FügenA. Belguanche, A. Schumacher, N. Desch, A. Benachour, J. Böttcher, G. Dietrich, E. Pflug, I. Spies, P. Meyer, B. Folkmer, S. Knappmann, P. Farber, J. Gräbel, M. Lake, A. Dehé 9. GMM-Workshop Mikro-Nano-Integration, 21. – 22. November, Aachen, Deutschland |
2022 |
Modellierung und Simulation des reaktiven FügeprozessesA. Schumacher, B. Folkmer, S. Knappmann, A. Dehé, A. Belguanche, A. Benachour, P. Farber, N. Desch, M. Lake, E. Pflug, J. Böttcher, G. Dietrich TechnologyMountains InnovationForum Smarte Technologien & Systeme, 31. März, Donaueschingen, Deutschland |
2022 |
Novel Fabrication Technology for Thermoelectric Infrared Sensors Using Surface MicromachiningP. Raimann, S. Billat, I. Spies, J. Dietrich, D. Hoffmann, S. Keller, A. Dehé Smart Systems Integration, 27.-28. April 2022, Grenoble, Frankreich show abstractIn this paper a novel fabrication technology for thermoelectric infrared sensors is presented. For the first time, the thermal insulation of the absorber structure is achieved by self-assembling multilayer thermocouples. After removal of a sacrificial oxide layer by vapor hydrogen fluoride (vHF) etching, the thermocouples lift off due to residual stress gradients. This provides the necessary distance between the absorber and the substrate. Compared to state-of-the-art sensors, this implementation does not require extensive bulk processing such as grinding and cavity etching to achieve a thermally isolated absorber structure. The deflection of the realized structures has shown high agreement with an analytical model which is also presented in this paper.
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2022 |
Microthermoforming - enhancing Blister technologyD. Kainz 12th European Thermoforming Conference 2022, 31st March - 1st April 2022, Vienna, Austria |
2021 |
Reaktives Fügen von temperaturempfindlichen DehnungssensorenA. Schumacher, V. Shah, S. Steckemetz, G. Dietrich, E. Pflug, T. Hehn, S. Knappmann, A. Dehé, A. Leson Journal of Materials Engineering and Performance, Band 30, pp. 7796-7804 |
2021 |
Reaktives Fügen von temperaturempfindlichen DehnungssensorenE. Pflug, A. Schumacher, G. Dietrich, S. Steckemetz, T. Hehn, S. Knappmann, A. Dehé, A. Leson 27. Neues Dresdner vakuumtechnisches Kolloquium (NDVaK), 17. - 18. März 2021, Online |
2021 |
Telemetrische Verformungsmessung mit einem CMOS-integrierten SensorchipT. Hehn, H. Rietsche Sensor und Test 2021, 04. - 06. Mai 2021, Online |
2021 |
Aufbau und Charakterisierung eines CMOS-integrierten Sensorsystems zur Messung von VerformungenA. Schumacher, V. Shah, S. Knappmann, T. Hehn, A. Dehé Mikrosystemtechnik-Kongress 2021, 9. - 10. November 2021, Ludwigsburg |
2021 |
Improved Mounting of Strain Sensors by Reactive BondingA. Schumacher, V. Shah, S. Steckemetz, G. Dietrich, E. Pflug, T. Hehn, S. Knappmann, A. Dehé, A. Leson Journal of Materials Engineering and Performance 30, 7796 - 7804 (2021) show abstractAim of this work is to improve the bond between a strain sensor and a device on which the strain shall be determined. As strain sensor, a CMOS-integrated chip featuring piezoresistive sensor elements was used which is capable of wireless energy and data transmission. The sensor chip was mounted on a standardized tensile test specimen of stainless steel by a bonding process using reactive multilayer systems (RMS). RMS provide a well-defined amount of heat within a very short reaction time of a few milliseconds and are placed in-between two bonding partners. RMS were combined with layers of solder which melt during the bonding process. Epoxy adhesive films were used as a reference bonding process. Under mechanical tensile loading, the sensor bonded with RMS shows a linear strain sensitivity in the whole range of tested forces whereas the adhesive-bonded sensor has slightly nonlinear behavior for low forces. Compared to the adhesive-bonded chips, the sensitivity of the reactively bonded chips is increased by a factor of about 2.5. This indicates a stronger mechanical coupling by reactive bonding as compared to adhesive bonding. |
2020 |
Temperature Dependence of the Steering Angles of a Silicon Photonic Optical Phased ArrayPAK Yepez, U Scholz, A Zimmermann IEEE Photonics Journal 12 (2), 1-13, 2020 |