Jahr Name
2024

Optimierte reaktive Bondtechnologie auf der Basis neuartiger Zirkonium Systeme für den Einsatz in der Mikrosystemtechnik (Join-ZiSi)

A. Schumacher, G. Buschbeck, I. Käpplinger

Abschlussbericht zum IGF-Vorhaben Nr. 21347 BG

2023

Micro-Electrode-Cavity-Array (MECA) on a CMOS Chip

M. Amayreh, S. Elsaegh, M. Kuderer, C. Blattert, H. Rietsche, O. Amft

Black Forest Nanopore Meeting 2023, 06.-09.11.2023, Freiburg, Deutschland

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  • This work represents a CMOS-Based nanoporesensing platform for high resolution readout of nanoporeevents.
  • CMOS integration reduces the overall capacitance of the readout which reduces the overall noise and thus allows detecting of fast and/or small nanoporeevents.
  • The current readout circuit is configurable for different current ranges and bandwidths and optimized for noise suppression. The circuit is divided into four amplifier stages.
  • Noise reduction techniques achieve a total integrated noise of only 18 pARMSin a bandwidth of 1 MHz.
  • The ASIC was implemented in a 350 nm standard CMOS technology.
  • The ASIC consists of five channels. Four of them are used as a MECA.

 

Link to paper

2023

Reactive bonding of an integrated CMOS strain sensor to steel by using hard and soft solders

A. Schumacher, P. Meyer, G. Buschbeck, E. Pflug, J. Böttcher, S. Knappmann, T. Hehn, A. Dehé

MikroSystemTechnik Kongress 2023, 23.-25.10.2023, Dresden, Deutschland
ISBN: 978-3-8007-6203-3 (CD-ROM), 978-3-8007-6204-0 (E-Book), VDE Verlag GmbH

2023

Optimierte reaktive Bondtechnologie auf der Basis neuartiger Zirkonium Systeme für den Einsatz in der Mikrosystemtechnik (Join ZiSi)

A. Schumacher, G. Buschbeck, J. Böttcher, A. Grün, I. Käpplinger, S. Knappmann, P. Meyer, E. Pflug, A. Dehé

DVS Congress 2023, 11.-14.09.2023, Essen, Deutschland
DVS-Berichte Band 389, ISBN: 978-3-96144-230-0 (Print), 978-3-96144-231-7 (E-Book), DVS Media GmbH, Düsseldorf

2023

Reactive joining with braze: Novel zirconium based systems

E. Pflug, G. Buschbeck, A. Schumacher, J. Böttcher, S. Knappmann, P. Meyer, A. Dehé, O. Zimmer, V. Weihnacht

V-Messe, 18.-21.09.2023, Dresden, Deutschland

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2023

„EDIH Südwest“ – Beratungs- und Technologieangebote zur digitalen Transformation

S. Spieth

14. InnovationForum Smarte Technologien & Systeme, 15. Juni 2023, Donaueschingen

2023

„EDIH Südwest“ – Beratungs- und Technologieangebote zur digitalen Transformation von Unternehmen und Verwaltung

S. Spieth

microTEC Südwest Clusterkonferenz 2023, 15.-16. Mai 2023, Freiburg

2022

Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics

Peter Wappler, Tim Horter, Romit Kulkarni, Thomas Guenther, Karl-Peter Fritz & André Zimmermann

International Journal of Advanced Manufacturing Technology

2022

European Digital Innovation Hubs & their activities for SMEs

Rainer Günzler

Smart Systems Integration 2022, 26. – 28. April, Grenoble, Frankreich

2022

Effective MEMS Manufacturing Using Vapor HF Etch Processing Illustrated by Means of a Sterilization Cycle Counter

N. Baum, R. Vora, G. Endress, I. Spies, D. Hoffmann, H. Trautner, C. Blattert, A. Dehé, D. Anderson, T. O‘Hara

9. GMM Fachtagung Mikro-Nano-Integration, 21. – 22. November 2022, Aachen

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In the aftermath of COVID-19 and with an increased awareness of health issues, the use of precisely targeted technological
methodologies for the solution of specific healthcare problems is becoming increasing important in medical applications. The use of MEMS technology for the development of an efficient sterilisation cycle counter by Hahn-Schickard is a simple but very effective example of such an application. Surface micromachining is applied utilizing vapor HF (vHF) etching and subsequent polymer anti-stiction coating as an efficient technique to remove sacrificial buried oxide layers and to release micro structure without stiction. The vHF etching process has been optimized and reaches etch rates of 900 nm/min for the buried oxide with a uniformity of more than 95 % across a 100 mm wafer.

 

Link to publication

2022

Modellbasiertes reaktives Fügen

A. Belguanche, A. Schumacher, N. Desch, A. Benachour, J. Böttcher, G. Dietrich, E. Pflug, I. Spies, P. Meyer, B. Folkmer, S. Knappmann, P. Farber, J. Gräbel, M. Lake, A. Dehé

9. GMM-Workshop Mikro-Nano-Integration, 21. – 22. November, Aachen, Deutschland

2022

Modellierung und Simulation des reaktiven Fügeprozesses

A. Schumacher, B. Folkmer, S. Knappmann, A. Dehé, A. Belguanche, A. Benachour, P. Farber, N. Desch, M. Lake, E. Pflug, J. Böttcher, G. Dietrich

TechnologyMountains InnovationForum Smarte Technologien & Systeme, 31. März, Donaueschingen, Deutschland

2022

Novel Fabrication Technology for Thermoelectric Infrared Sensors Using Surface Micromachining

P. Raimann, S. Billat, I. Spies, J. Dietrich, D. Hoffmann, S. Keller, A. Dehé

Smart Systems Integration, 27.-28. April 2022, Grenoble, Frankreich

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In this paper a novel fabrication technology for thermoelectric infrared sensors is presented. For the first time, the thermal insulation of the absorber structure is achieved by self-assembling multilayer thermocouples. After removal of a sacrificial oxide layer by vapor hydrogen fluoride (vHF) etching, the thermocouples lift off due to residual stress gradients. This provides the necessary distance between the absorber and the substrate. Compared to state-of-the-art sensors, this implementation does not require extensive bulk processing such as grinding and cavity etching to achieve a thermally isolated absorber structure. The deflection of the realized structures has shown high agreement with an analytical model which is also presented in this paper.

 

Link to paper
Link to publication

2022

Microthermoforming - enhancing Blister technology

D. Kainz

12th European Thermoforming Conference 2022, 31st March - 1st April 2022, Vienna, Austria

2021

Reaktives Fügen von temperaturempfindlichen Dehnungssensoren

A. Schumacher, V. Shah, S. Steckemetz, G. Dietrich, E. Pflug, T. Hehn, S. Knappmann, A. Dehé, A. Leson

Journal of Materials Engineering and Performance, Band 30, pp. 7796-7804


Link to publication

2021

Reaktives Fügen von temperaturempfindlichen Dehnungssensoren

E. Pflug, A. Schumacher, G. Dietrich, S. Steckemetz, T. Hehn, S. Knappmann, A. Dehé, A. Leson

27. Neues Dresdner vakuumtechnisches Kolloquium (NDVaK), 17. - 18. März 2021, Online

2021

Telemetrische Verformungsmessung mit einem CMOS-integrierten Sensorchip

T. Hehn, H. Rietsche

Sensor und Test 2021, 04. - 06. Mai 2021, Online

2021

Aufbau und Charakterisierung eines CMOS-integrierten Sensorsystems zur Messung von Verformungen

A. Schumacher, V. Shah, S. Knappmann, T. Hehn, A. Dehé

Mikrosystemtechnik-Kongress 2021, 9. - 10. November 2021, Ludwigsburg

2021

Improved Mounting of Strain Sensors by Reactive Bonding

A. Schumacher, V. Shah, S. Steckemetz, G. Dietrich, E. Pflug, T. Hehn, S. Knappmann, A. Dehé, A. Leson

Journal of Materials Engineering and Performance 30, 7796 - 7804 (2021)

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Aim of this work is to improve the bond between a strain sensor and a device on which the strain shall be determined. As strain sensor, a CMOS-integrated chip featuring piezoresistive sensor elements was used which is capable of wireless energy and data transmission. The sensor chip was mounted on a standardized tensile test specimen of stainless steel by a bonding process using reactive multilayer systems (RMS). RMS provide a well-defined amount of heat within a very short reaction time of a few milliseconds and are placed in-between two bonding partners. RMS were combined with layers of solder which melt during the bonding process. Epoxy adhesive films were used as a reference bonding process. Under mechanical tensile loading, the sensor bonded with RMS shows a linear strain sensitivity in the whole range of tested forces whereas the adhesive-bonded sensor has slightly nonlinear behavior for low forces. Compared to the adhesive-bonded chips, the sensitivity of the reactively bonded chips is increased by a factor of about 2.5. This indicates a stronger mechanical coupling by reactive bonding as compared to adhesive bonding.
 

Link to publication

2020

Temperature Dependence of the Steering Angles of a Silicon Photonic Optical Phased Array

PAK Yepez, U Scholz, A Zimmermann

IEEE Photonics Journal 12 (2), 1-13, 2020