Jahr Name
2022

European Digital Innovation Hubs & their activities for SMEs

Rainer Günzler

Smart Systems Integration 2022, 26. – 28. April, Grenoble, Frankreich
2022

Scaling Rules for Microrobots with Full Energetic Autonomy

E. van Renselaar, B. Keitel, M. Dinc, B. Mizaikoff, A. Susarrey-Arce, H. J. G. E. Gardeniers, L. Abelmann, I. S. M. Khalil

International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS), 1-6, doi: 10.1109/MARSS55884.2022.9870509
2022

A Lightweight Mutual Authentication Protocol Based on Physical Unclonable Functions

S. Abdolinezhad, A. Sikora

IEEE International Symposium on Hardware Oriented Security and Trust (HOST), pp. 161-164, doi: 10.1109/HOST54066.2022.9840132
2022

Design, Simulation, and Analysis of Physical Unclonable Functions with MEMS AlN Cantilevers

S. Abdolinezhad, A. Sikora, A. Bittner

Smart Systems Integration (SSI), pp. 1-6, doi: 10.1109/SSI56489.2022.9901420
2022

Systematic Test Environment for Narrowband IoT Technologies

J.E. Sebastian, A. Sikora

Jasperneite, J., Lohweg, V. (eds) Kommunikation und Bildverarbeitung in der Automation. Technologien für die intelligente Automation, vol 14. Springer Vieweg, Berlin, Heidelberg


Link zum Paper
2022

Evaluation of the biomarker Dickkopf 3 in more than 1100 CKD patients of a German single center cohort using algorithm-based data analysis

T. Weinreich, E. Seibert, E. Brohammer, M. Rüb, F. Gehlen, A. Sikora, B. Hohenstein

Abstracts der 14. Jahrestagung der Deutschen Gesellschaft für Nephrologie, „Kongress für Nephrologie”, Oktober, 6-9, Berlin
pp.52-53, ISSN 1869-9405 ZKZ 18874


Link zum Paper
2022

Education for Resource Efficiency in Manufacturing Industries EREMI

G.P. Georgiev, T.P. Titova, R. Kosturkov, A. Sikora, G. Janevska, M. Kostov, S. Halunga, O. Fratu

57th International Scientific Conference on Information, Communication and Energy Systems and Technologies (ICEST), pp. 1-4,
doi: 10.1109/ICEST55168.2022.9828770
2022

A Survey on Network Optimization Techniques for Blockchain Systems

R. Antwi, J.D. Gadze, E.T. Tchao, A. Sikora, H. Nunoo-Mensah, A.S. Agbemenu, K.O.-B. Obour Agyekum, J.O. Agyemang, D. Welte, E. Keelson

Algorithms 2022, 15, 193


Link zum Paper
2022

Schloss: Blockchain-Based System Architecture for Secure Industrial IoT

F.G. Ghajar, A. Sikora, D. Welte

Electronics 2022, 11, 1629


Link zum Paper
2022

Blockchain-IoT peer device storage optimization using an advanced time-variant multi-objective particle swarm optimization algorithm

C. Nartey, E.T. Tchao, J.D. Gadze, B. Yeboah–Akowuah, H. Nunoo–Mensah, D. Welte, A. Sikora

J Wireless Com Network 2022, 5 (2022), pp. 1-27


Link zum Paper
2022

Calibration methods for flow rates down to 5 nL/min and validation methodology

C. Mills, E. Batista, H. Bissig, F. Ogheard, A. W. Boudaoud, O. Büker, K. Stolt, J. Morgan, S. Kartmann, K. Thiemann, G. Miotto, A. Niemann, S. Klein, G. Ratering, J. Lötters

Biomed. Eng.-Biomed. Tech. 2022; aop, doi: 10.1515/bmt-2022-0049
2022

Development of roll-to-roll feasible, direct coating technique for membrane electrode assemblies

C. Schwarz, F. Lombeck, H. Nguyen, F. Khan, D. Sultanova, K. Yildirim, M. Breitwieser

Gordon Research Conference, July 24 - 29, 2022, Smithfield, RI, USA
2022

Digitaler Retrofit von Maschinen und Produktionsanlagen

Karl-Peter Fritz, Henning Strauß, Christoph Rathfelder, André Bülau, Daniel Gaida

ISSN: Vogel Fachuch 978-3-8343-3481-7


Link zum Paper
2021

Development and Construction of a Parameterizable Condition Classification System for Electromagnetic Proportional Valves using Neuronal Networks (Nemoh / Neuromorphe Hardware für Anwendungen mit KI)

D. Rossbach, M. Rüb, M. Kuderer, Y. Manoli

MikroSystemTechnik Congress 2021, 8-10 Nov. 2021, Stuttgart-Ludwigsburg, Germany

show abstract

In this paper the development of a compact condition classification system for electromagnetic proportional valves is shown. It allows the generation of training data as well as a fast testing and comparison of different trained neuronal networks. By using quantization and pruning, a neuronal network with drastically reduced complexity has been created, so an FPGA implementation was possible. The developed and implemented network shows a very high classification rate and can distinguish 12 different error reasons of the valves. The system requires the measurement of the supply current only, which allows a simple integration of such a false detection circuitry into existing systems. In the future, the system can be modified easily, e.g. to use and test a hardware based AI accelerator instead of the FPGA implementation.

 

Link zum Paper
2021

STAG4Iot Projekt: STAG – Sensor Technology Adapter Gateway. Eine modulare Adapter Lösung für Sensoren im industriellen Internet der Dinge (IoT)

Dovydas Girdvainis, Christoph Rathfelder, Gerhard Marki

IoT-Konferenz / Edge & Cloud Control 2021, 20.10.2021, Online

show abstract

Intelligente Sensorsysteme sind die Grundlage einer intelligenten Fabrik und damit auch ein Baustein von Industrie 4.0. Sensorsysteme verschiedener Hersteller verwenden allerdings oft unterschiedliche und häufig auch proprietäre Kommunikationsprotokolle. Dies kann zur Herausforderung werden, wenn all diese Systeme in eine zentrale Datenverarbeitung oder gar IoT-Plattform integriert werden sollen. Noch komplizierter wird es, wenn die Sensorsysteme parallel in unterschiedliche IoT-Plattformen oder Datenbanken integriert werden sollen, um verschiedene Anwendungsfälle zu erfüllen. Zum Beispiel eine IoT-Plattform zur Überwachung von Sensordaten in Echtzeit und eine separate Datenbank, die für ein prädiktives Wartungssystem genutzt wird.  Ein modulares Sensor-Adapter-Gateway, wie das in diesem Vortrag vorgestellte Open-Source Projekt STAG, hilft, die Integrationskomplexität zu reduzieren, indem unterschiedliche Sensorkommunikationssysteme mit einem einheitlichen Modell abstrahiert werden und das IoT-Plattform-spezifische Modell automatisch konstruiert wird. Darüber hinaus lässt sich ein solches System durch Hinzufügen neuer Sensoradapter leicht erweitern. Es bietet eine einfache Schnittstelle auch für zukünftige IoT-Lösungen. In dieser Präsentation möchten wir einen Einblick in unser frei verfügbares Sensor Technology Adapter Gateway (STAG) geben und unsere bisher gesammelten Erfahrungen präsentieren.

Link zum Beitrag
2020

Evaluation of process and anisotropy of thermosetting adhesives with ultraviolet-assisted 3D dispensing

K Schmidt, A Zimmermann

Additive Manufacturing 34, 101262, 2020
2020

Conceptual Planning of Micro-Assembly for a Better Utilization of Reconfigurable Manufacturing Systems

C. Gielisch. K.-P. Fritz, B. Wigger und A. Zimmermann

Applied Sciences, 10. Jg., Nr.8, pp. von Seite – bis Seite: 2806 - 2824, 2020, 02P15A120

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Reconfigurable manufacturing systems (RMS) can be used to produce micro-assembled products that are too complex for assembly on flat substrates like printed circuit boards. The greatest advantage of RMS is their capability to reuse machine parts for different products, which enhances the economical efficiency of quickly changing or highly individualized products. However, often, process engineers struggle to achieve the full potential of RMS due to product designs not being suited for their given system. Guaranteeing a better fit cannot be done by static guidelines because the higher degree of freedom would make them too complex. Therefore, a new method for generating dynamic guidelines is proposed. The method consists of a model, with which designers can create a simplified assembly sequence of their product idea, and another model, with which process engineers can describe the RMS and the procedures and operations that it can offer. By combining both, a list of possible machine configurations for an RMS can be generated as an automated response for a modeled assembly sequence. With the planning tool for micro-assembly, an implementation of this method as a modern web application is shown, which uses a real existent RMS for micro-assembly.

Link to publication
2020

Reliability of Mechatronic Integrated Devices Regarding Failure Mechanisms

P. Bräuer, L. Wurzer, T. Kuhn, A. Knöller, H. Müller, W. Eberhardt, A. Zimmermann, J. Franke

2020 43rd International Spring Seminar on Electronics Technology (ISSE);14.-15.05.2020, geplant im Demanovska Valley (Slowakei), wegen Corona aber Online


IEEE, 19754 N (MetaZu)

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Link to publication 
2020

Selective laser induced autocatalytic metallization of NiO and Cr2O3 doped alumina zirconia ceramic substrates

P. Ninz, F. Kern, S. Petillon, W. Eberhardt, A. Zimmermann, R. Gadow

Journal of the European Ceramic Society, Volume 40, Issue 11, 2020, S.  3733-3743.

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Link to publication
2020

Mass-producible micro-optical elements by injection compression molding and focused ion beam structured titanium molding tools

Guenther, T.; Diegel, L.; Roeder, M.; Drexler, M.; Haybat, M.; Wappler, P.; Soltani, M.; Zimmermann, A.

Apllied sciences, 2076-3417, pp. von Seite – bis Seite: 4197, 2020

show abstract

Thermoset materials offer a multitude of advantageous properties in terms of shrinkage and warpage as well as mechanical, thermal and chemical stability compared to thermoplastic materials. Thanks to these properties, thermosets are commonly used to encapsulate electronic components on a 2nd-level packaging prior to assembly by reflow soldering on printed circuits boards or other substrates. Based on the characteristics of thermosets to develop a distinct skin effect due to segregation during the molding process, the surface properties of injection molded thermoset components resemble optical characteristics. Within this study, molding parameters for thermoset components are analyzed in order to optimize the surface quality of injection molded thermoset components. Perspectively, in combination with a reflective coating by e.g., physical vapor deposition, such elements with micro-integrated reflective optical features can be used as optoelectronic components, which can be processed at medium-ranged temperatures up to 230 °C. The obtained results indicate the general feasibility since Ra values of 60 nm and below can be achieved. The main influencing parameters on surface quality were identified as the composition of filler materials and tool temperature.

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