| Jahr | Name |
|---|---|
| 2022 |
European Digital Innovation Hubs & their activities for SMEsRainer Günzler Smart Systems Integration 2022, 26. – 28. April, Grenoble, Frankreich |
| 2022 |
Scaling Rules for Microrobots with Full Energetic AutonomyE. van Renselaar, B. Keitel, M. Dinc, B. Mizaikoff, A. Susarrey-Arce, H. J. G. E. Gardeniers, L. Abelmann, I. S. M. Khalil International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS), 1-6, doi: 10.1109/MARSS55884.2022.9870509 |
| 2022 |
A Lightweight Mutual Authentication Protocol Based on Physical Unclonable FunctionsS. Abdolinezhad, A. Sikora IEEE International Symposium on Hardware Oriented Security and Trust (HOST), pp. 161-164, doi: 10.1109/HOST54066.2022.9840132 |
| 2022 |
Design, Simulation, and Analysis of Physical Unclonable Functions with MEMS AlN CantileversS. Abdolinezhad, A. Sikora, A. Bittner Smart Systems Integration (SSI), pp. 1-6, doi: 10.1109/SSI56489.2022.9901420 |
| 2022 |
Systematic Test Environment for Narrowband IoT TechnologiesJ.E. Sebastian, A. Sikora Jasperneite, J., Lohweg, V. (eds) Kommunikation und Bildverarbeitung in der Automation. Technologien für die intelligente Automation, vol 14. Springer Vieweg, Berlin, Heidelberg |
| 2022 |
Evaluation of the biomarker Dickkopf 3 in more than 1100 CKD patients of a German single center cohort using algorithm-based data analysisT. Weinreich, E. Seibert, E. Brohammer, M. Rüb, F. Gehlen, A. Sikora, B. Hohenstein Abstracts der 14. Jahrestagung der Deutschen Gesellschaft für Nephrologie, „Kongress für Nephrologie”, Oktober, 6-9, Berlin |
| 2022 |
Education for Resource Efficiency in Manufacturing Industries EREMIG.P. Georgiev, T.P. Titova, R. Kosturkov, A. Sikora, G. Janevska, M. Kostov, S. Halunga, O. Fratu 57th International Scientific Conference on Information, Communication and Energy Systems and Technologies (ICEST), pp. 1-4, |
| 2022 |
A Survey on Network Optimization Techniques for Blockchain SystemsR. Antwi, J.D. Gadze, E.T. Tchao, A. Sikora, H. Nunoo-Mensah, A.S. Agbemenu, K.O.-B. Obour Agyekum, J.O. Agyemang, D. Welte, E. Keelson Algorithms 2022, 15, 193 |
| 2022 |
Schloss: Blockchain-Based System Architecture for Secure Industrial IoTF.G. Ghajar, A. Sikora, D. Welte Electronics 2022, 11, 1629 |
| 2022 |
Blockchain-IoT peer device storage optimization using an advanced time-variant multi-objective particle swarm optimization algorithmC. Nartey, E.T. Tchao, J.D. Gadze, B. Yeboah–Akowuah, H. Nunoo–Mensah, D. Welte, A. Sikora J Wireless Com Network 2022, 5 (2022), pp. 1-27 |
| 2022 |
Calibration methods for flow rates down to 5 nL/min and validation methodologyC. Mills, E. Batista, H. Bissig, F. Ogheard, A. W. Boudaoud, O. Büker, K. Stolt, J. Morgan, S. Kartmann, K. Thiemann, G. Miotto, A. Niemann, S. Klein, G. Ratering, J. Lötters Biomed. Eng.-Biomed. Tech. 2022; aop, doi: 10.1515/bmt-2022-0049 |
| 2022 |
Development of roll-to-roll feasible, direct coating technique for membrane electrode assembliesC. Schwarz, F. Lombeck, H. Nguyen, F. Khan, D. Sultanova, K. Yildirim, M. Breitwieser Gordon Research Conference, July 24 - 29, 2022, Smithfield, RI, USA |
| 2022 |
Digitaler Retrofit von Maschinen und ProduktionsanlagenKarl-Peter Fritz, Henning Strauß, Christoph Rathfelder, André Bülau, Daniel Gaida ISSN: Vogel Fachuch 978-3-8343-3481-7 |
| 2021 |
Development and Construction of a Parameterizable Condition Classification System for Electromagnetic Proportional Valves using Neuronal Networks (Nemoh / Neuromorphe Hardware für Anwendungen mit KI)D. Rossbach, M. Rüb, M. Kuderer, Y. Manoli MikroSystemTechnik Congress 2021, 8-10 Nov. 2021, Stuttgart-Ludwigsburg, Germany show abstractIn this paper the development of a compact condition classification system for electromagnetic proportional valves is shown. It allows the generation of training data as well as a fast testing and comparison of different trained neuronal networks. By using quantization and pruning, a neuronal network with drastically reduced complexity has been created, so an FPGA implementation was possible. The developed and implemented network shows a very high classification rate and can distinguish 12 different error reasons of the valves. The system requires the measurement of the supply current only, which allows a simple integration of such a false detection circuitry into existing systems. In the future, the system can be modified easily, e.g. to use and test a hardware based AI accelerator instead of the FPGA implementation.
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| 2021 |
STAG4Iot Projekt: STAG – Sensor Technology Adapter Gateway. Eine modulare Adapter Lösung für Sensoren im industriellen Internet der Dinge (IoT)Dovydas Girdvainis, Christoph Rathfelder, Gerhard Marki IoT-Konferenz / Edge & Cloud Control 2021, 20.10.2021, Online show abstractIntelligente Sensorsysteme sind die Grundlage einer intelligenten Fabrik und damit auch ein Baustein von Industrie 4.0. Sensorsysteme verschiedener Hersteller verwenden allerdings oft unterschiedliche und häufig auch proprietäre Kommunikationsprotokolle. Dies kann zur Herausforderung werden, wenn all diese Systeme in eine zentrale Datenverarbeitung oder gar IoT-Plattform integriert werden sollen. Noch komplizierter wird es, wenn die Sensorsysteme parallel in unterschiedliche IoT-Plattformen oder Datenbanken integriert werden sollen, um verschiedene Anwendungsfälle zu erfüllen. Zum Beispiel eine IoT-Plattform zur Überwachung von Sensordaten in Echtzeit und eine separate Datenbank, die für ein prädiktives Wartungssystem genutzt wird. Ein modulares Sensor-Adapter-Gateway, wie das in diesem Vortrag vorgestellte Open-Source Projekt STAG, hilft, die Integrationskomplexität zu reduzieren, indem unterschiedliche Sensorkommunikationssysteme mit einem einheitlichen Modell abstrahiert werden und das IoT-Plattform-spezifische Modell automatisch konstruiert wird. Darüber hinaus lässt sich ein solches System durch Hinzufügen neuer Sensoradapter leicht erweitern. Es bietet eine einfache Schnittstelle auch für zukünftige IoT-Lösungen. In dieser Präsentation möchten wir einen Einblick in unser frei verfügbares Sensor Technology Adapter Gateway (STAG) geben und unsere bisher gesammelten Erfahrungen präsentieren. |
| 2020 |
Evaluation of process and anisotropy of thermosetting adhesives with ultraviolet-assisted 3D dispensingK Schmidt, A Zimmermann Additive Manufacturing 34, 101262, 2020 |
| 2020 |
Conceptual Planning of Micro-Assembly for a Better Utilization of Reconfigurable Manufacturing SystemsC. Gielisch. K.-P. Fritz, B. Wigger und A. Zimmermann Applied Sciences, 10. Jg., Nr.8, pp. von Seite – bis Seite: 2806 - 2824, 2020, 02P15A120 show abstractReconfigurable manufacturing systems (RMS) can be used to produce micro-assembled products that are too complex for assembly on flat substrates like printed circuit boards. The greatest advantage of RMS is their capability to reuse machine parts for different products, which enhances the economical efficiency of quickly changing or highly individualized products. However, often, process engineers struggle to achieve the full potential of RMS due to product designs not being suited for their given system. Guaranteeing a better fit cannot be done by static guidelines because the higher degree of freedom would make them too complex. Therefore, a new method for generating dynamic guidelines is proposed. The method consists of a model, with which designers can create a simplified assembly sequence of their product idea, and another model, with which process engineers can describe the RMS and the procedures and operations that it can offer. By combining both, a list of possible machine configurations for an RMS can be generated as an automated response for a modeled assembly sequence. With the planning tool for micro-assembly, an implementation of this method as a modern web application is shown, which uses a real existent RMS for micro-assembly. |
| 2020 |
Reliability of Mechatronic Integrated Devices Regarding Failure MechanismsP. Bräuer, L. Wurzer, T. Kuhn, A. Knöller, H. Müller, W. Eberhardt, A. Zimmermann, J. Franke 2020 43rd International Spring Seminar on Electronics Technology (ISSE);14.-15.05.2020, geplant im Demanovska Valley (Slowakei), wegen Corona aber Online IEEE, 19754 N (MetaZu) show abstract |
| 2020 |
Selective laser induced autocatalytic metallization of NiO and Cr2O3 doped alumina zirconia ceramic substratesP. Ninz, F. Kern, S. Petillon, W. Eberhardt, A. Zimmermann, R. Gadow Journal of the European Ceramic Society, Volume 40, Issue 11, 2020, S. 3733-3743. show abstract |
| 2020 |
Mass-producible micro-optical elements by injection compression molding and focused ion beam structured titanium molding toolsGuenther, T.; Diegel, L.; Roeder, M.; Drexler, M.; Haybat, M.; Wappler, P.; Soltani, M.; Zimmermann, A. Apllied sciences, 2076-3417, pp. von Seite – bis Seite: 4197, 2020 show abstractThermoset materials offer a multitude of advantageous properties in terms of shrinkage and warpage as well as mechanical, thermal and chemical stability compared to thermoplastic materials. Thanks to these properties, thermosets are commonly used to encapsulate electronic components on a 2nd-level packaging prior to assembly by reflow soldering on printed circuits boards or other substrates. Based on the characteristics of thermosets to develop a distinct skin effect due to segregation during the molding process, the surface properties of injection molded thermoset components resemble optical characteristics. Within this study, molding parameters for thermoset components are analyzed in order to optimize the surface quality of injection molded thermoset components. Perspectively, in combination with a reflective coating by e.g., physical vapor deposition, such elements with micro-integrated reflective optical features can be used as optoelectronic components, which can be processed at medium-ranged temperatures up to 230 °C. The obtained results indicate the general feasibility since Ra values of 60 nm and below can be achieved. The main influencing parameters on surface quality were identified as the composition of filler materials and tool temperature. |
Scientific Publications "Industry + Process Technology"
