Innovations enabled by Flexible Electronics
End users, supply chain companies, R&D organizations, start-ups and universities are invited to submit abstracts for the 2018FLEX Europe Conference.
FLEX Europe Conference will be held in cooperation with Fraunhofer EMFT’s forum BE-FLEXIBLE. This conference, an integral part of SEMICON Europa 2018 co-located with electronica, will address materials, manufacturing, new technologies and applications for flexible hybrid electronics (FHE) and printed electronics (PE) and will demonstrate the strong history of Europe in the field.
CALL FOR PAPERS Extended till 18th May 2018
Are you influencing the direction of semiconductor technology? Submit an abstract, present and contribute on critical industry topics shaping the design and manufacturing of semiconductors and adjacent markets.
Apply now: http://www.semiconeuropa.org/programs-catalog/call-papers
For further information please check: http://www.semiconeuropa.org/flex-europe-be-flexible