Hahn-Schickard and the research association 3-D MID e. V. will combine the events "MID Summit" & "MID Workshop" this year as a joint industry get-together on September 21th and 22th in Böblingen (Stuttgart region).
We offer two intensive days around the MID topic with expert presentations from industry and research with many application examples, poster session, trade exhibition and plenty of time for exchange and networking.
In recent years, MID technology has evolved. This is reflected in the change of the name MID from Molded Interconnect Devices to Mechatronic Integrated Devices. New materials and processes have expanded the range of applications and possible functionalization of 3D circuit carriers. Additive manufacturing processes, for example, are opening up new routes for the rapid realization of prototypes and the individualization of products.
Take a look at the event details.
Take the opportunity to gain new insights and exchange ideas and register here.
We are looking forward to your visit!